TLX9309 TOSHIBA Photocoupler IRLED + Photo IC TLX9309 Unit: mm Inverter Control Applications Interface for Intelligent Power Modules HEV (Hybrid Electric Vehicle) and EV (Electric Vehicle) Applications The TOSHIBA TLX9309 mini-flat photocoupler is suitable for surface-mount assembly. The TLX9309 consists of a high-output infrared LED optically coupled to a high-speed detector, which consists of a photodiode and a transistor integrated on a single chip. Faraday shield integrated on the photodetector chip provides an enhanced common-mode transient immunity. The TLX9309 guarantees minimum and maximum propagation delay time, propagation delay difference between t t , and high pHL and pLH common-mode transient immunity. Therefore, the TLX9309 is suitable for isolation interface between an IPM (intelligent power module) and a control IC TOSHIBA 11 4L1S circuit in motor control applications. Weight: 0.08 g (typ.) Pin Isolation voltage: 3750 V (min) rms Configuration (top view) Common mode transient immunity: 10 kV/ s (min) V =1500V CM 1 6 Propagation delay time: t t = 0.1 s (min), pHL, pLH t = 0.8 s (max) t = 1.0 s (max) pHL , pLH 5 I = 7 mA, V = 15 V, R =20 k , Ta=25C F CC L 4 3 Propagation delay difference: 0.7 s (max) SHIELD ( t t ) pLH pHL I = 7 mA, V = 15 V, R =20 k , Ta=25C F CC L 1 : Anode 3 : Cathode TTL-compatible 4 : Emitter (GND) 5 : Collector (Output) 6 : V CC Schematic I I F CC V 1 CC I 6 O V V O F 5 GND 3 Shield 4 2019 1 2019-06-28 Toshiba Electronic Devices & Storage Corporation TLX9309 Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25C) Characteristic Symbol Rating Unit Forward current (Note 1) I 15 mA F Pulse forward current (Note 2) I 30 mA FP Peak transient forward current (Note 3) I 1 A FPT Reverse voltage V 5 V R Input power dissipation PD 50 mW Output current I 25 mA O Peak output current I 50 mA OP Output voltage V 0.5 to 20 V O Supply voltage V 0.5 to 30 V CC Output power dissipation (Note 4) P 100 mW O Storage temperature range T 55 to 150 stg C Operating temperature range T 40 to 125 opr C Lead soldering temperature(10 s) T 260 sol C Isolation voltage(AC, 60 s., R.H.60%, Ta=25C) (Note 5) BV 3750 Vrms S Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Derate 0.14 mA / C above 70 C. Note 2: 50% duty cycle, 1ms pulse width. Derate 0.29 mA / C above 70 C. Note 3: Pulse width PW 1 s, 300pps. Note 4: Derate 1.8 mW / C above 70 C. Note 5: Device considered a two-terminal device: Pins1 and 3 are shorted together, and pins 4, 5 and 6 are shorted together. Recommended Operating Conditions (Note) Characteristic Symbol Min. Typ. Max. Unit Supply voltage V 30 V CC Output voltage V 20 V O Forward current I 7 12 mA F Operating temperature (Note 1) T -40 125 C opr Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. Note 1: Denotes the operating range, not the recommended operating condition. 2019 2 2019-06-28 Toshiba Electronic Devices & Storage Corporation Detector LED