5.13 mm SQJ850EP www.vishay.com Vishay Siliconix Automotive N-Channel 60 V (D-S) 175 C MOSFET FEATURES PRODUCT SUMMARY Halogen-free According to IEC 61249-2-21 V (V) 60 DS Definition R () at V = 10 V 0.023 DS(on) GS TrenchFET Power MOSFET R () at V = 4.5 V 0.032 DS(on) GS d AEC-Q101 Qualified I (A) 24 D 100 % R and UIS Tested g Configuration Single Compliant to RoHS Directive 2002/95/EC D PowerPAK SO-8L Single G D 4 G 3 S 2 S S 1 S N-Channel MOSFET ORDERING INFORMATION Package PowerPAK SO-8L Lead (Pb)-free and Halogen-free SQJ850EP-T1-GE3 ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise noted) C PARAMETER SYMBOLLIMITUNIT Drain-Source Voltage V 60 DS V Gate-Source Voltage V 20 GS T = 25 C 24 C a Continuous Drain Current I D T = 125 C 17 C a Continuous Source Current (Diode Conduction) I 24 A S b Pulsed Drain Current I 96 DM Single Pulse Avalanche Current I 15 AS L = 0.1 mH Single Pulse Avalanche Energy E 11 mJ AS T = 25 C 45 C b Maximum Power Dissipation P W D T = 125 C 15 C Operating Junction and Storage Temperature Range T , T - 55 to + 175 J stg C e, f Soldering Recommendations (Peak Temperature) 260 THERMAL RESISTANCE RATINGS PARAMETER SYMBOLLIMITUNIT c Junction-to-Ambient PCB Mount R 70 thJA C/W Junction-to-Case (Drain) R 3.3 thJC Notes a. Package limited. b. Pulse test pulse width 300 s, duty cycle 2 %. c. When mounted on 1 square PCB (FR-4 material). d. Parametric verification ongoing. e. See solder profile (www.vishay.com/doc 73257). The PowerPAK SO-8L. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components. S11-2419-Rev. F, 19-Dec-11 Document Number: 65280 1 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 6.15 mm SQJ850EP www.vishay.com Vishay Siliconix SPECIFICATIONS (T = 25 C, unless otherwise noted) C PARAMETER SYMBOLTEST CONDITIONS MIN.TYP.MAX.UNIT Static Drain-Source Breakdown Voltage V V = 0, I = 250 A 60 - - DS GS D V Gate-Source Threshold Voltage V V = V , I = 250 A 1.5 2.0 2.5 GS(th) DS GS D Gate-Source Leakage I V = 0 V, V = 20 V - - 100 nA GSS DS GS V = 0 V V = 60 V - - 1 GS DS Zero Gate Voltage Drain Current I V = 0 V V = 60 V, T = 125 C - - 50 A DSS GS DS J V = 0 V V = 60 V, T = 175 C - - 150 GS DS J a On-State Drain Current I V = 10 V V 5 V 30 - - A D(on) GS DS V = 10 V I = 10.3 A - 0.019 0.023 GS D V = 4.5 V I = 8.7 A - 0.026 0.032 GS D a Drain-Source On-State Resistance R DS(on) V = 10 V I = 10.3 A, T = 125 C - 0.034 0.040 GS D J V = 10 V I = 10.3 A, T = 175 C - 0.042 0.051 GS D J b Forward Transconductance g V = 15 V, I = 10.3 A - 29 - S fs DS D b Dynamic Input Capacitance C - 980 1225 iss Output Capacitance C -V = 0 V V = 30 V, f = 1 MHz170215 pF oss GS DS Reverse Transfer Capacitance C -7088 rss c Total Gate Charge Q -20 30 g c Gate-Source Charge Q -2V = 10 V V = 30 V, I = 6 A.9- nC gs GS DS D c Gate-Drain Charge Q -4.4- gd Gate Resistance R f = 1 MHz 0.20 1.12 2.04 g c Turn-On Delay Time t -21 29 d(on) c Rise Time t -15 22 r V = 30 V, R = 30 DD L ns c I 1 A, V = 10 V, R = 6.0 D GEN g Turn-Off Delay Time t -2235 d(off) c Fall Time t -812 f b Source-Drain Diode Ratings and Characteristics a Pulsed Current I -- 96 A SM Forward Voltage V I = 3.8 A, V = 0 - 0.8 1.2 V SD F GS Notes a. Pulse test pulse width 300 s, duty cycle 2 %. b. Guaranteed by design, not subject to production testing. c. Independent of operating temperature. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. S11-2419-Rev. F, 19-Dec-11 Document Number: 65280 2 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000