EMS41HJC-24.545454M (Data Sheet downloaded on Dec 20, 2018) REGULATORY COMPLIANCE 2011/65 + 191 SVHC 2015/863 ITEM DESCRIPTION Spread Spectrum MEMS Clock Oscillators LVCMOS (CMOS) 1.8Vdc 4 Pad 2.0mm x 2.5mm Plastic Surface Mount (SMD) 24.545454MHz 50ppm Maximum over -40C to +85C Power Down (Disabled Output Logic Low) 1.00% Center Spread ELECTRICAL SPECIFICATIONS Nominal Frequency 24.545454MHz Frequency Tolerance/Stability 50ppm Maximum over -40C to +85C (Inclusive of all conditions: Calibration Tolerance at 25C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25C, 260C Reflow, Shock, and Vibration) Aging at 25C 1ppm Maximum First Year Supply Voltage 1.8Vdc 5% Maximum Supply Voltage -0.5Vdc to +1.98Vdc Input Current 25mA Maximum (Unloaded Nominal Vdd) Output Voltage Logic High (Voh) 90% of Vdd Minimum (IOH=-8mA) Output Voltage Logic Low (Vol) 10% of Vdd Maximum (IOL=+8mA) Rise/Fall Time 2nSec Maximum (Measured from 20% to 80% of waveform) Duty Cycle 50 5(%) (Measured at 50% of waveform) Load Drive Capability 15pF Maximum Output Logic Type CMOS Output Control Function Power Down (Disabled Output Logic Low) Power Down Input Voltage (Vih and 70% of Vdd Minimum or No Connection to Enable Output, 30% of Vdd Maximum to Disable Output Vil) Standby Current 50A Maximum (Disabled Output: Logic Low) (Pad 1=Ground) Spread Spectrum 1.00% Center Spread Modulation Frequency 30kHz Minimum, 32kHz Typical, 35kHz Maximum Period Jitter 90pSec Maximum (Cycle to Cycle Spread Spectrum-On Fo=133.333M, Vdd=1.8Vdc) Start Up Time 10mSec Maximum Storage Temperature Range -55C to +125C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 2, HBM 2000V Flammability UL94-V0 Mechanical Shock MIL-STD-883, Method 2002, Condition G, 30,000G Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity Level J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 (Pads on Bottom of Package Only) Temperature Cycling MIL-STD-883, Method 1010, Condition B Thermal Shock MIL-STD-883, Method 1011, Condition B Vibration MIL-STD-883, Method 2007, Condition A, 20G www.ecliptek.com Specification Subject to Change Without Notice Revision E 03/04/2015 Page 1 of 4 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200EMS41HJC-24.545454M MECHANICAL DIMENSIONS (all dimensions in millimeters) PIN CONNECTION 1 Power Down (Logic Low) 2 Ground 2.00 1.00 0.50 0.10 (x4) 0.15 3 Output MAX 4 Supply Voltage 2 3 LINE MARKING 2.50 1.55 1 XXXX or XXXXX 0.15 0.10 XXXX or XXXXX=Ecliptek Manufacturing Identifier 1 4 0.60 0.10 0.75 0.10 (x4) Suggested Solder Pad Layout All Dimensions in Millimeters 1.10 (X4) 1.20 (X4) Solder Land 0.50 (X4) 0.30 All Tolerances are 0.1 www.ecliptek.com Specification Subject to Change Without Notice Revision E 03/04/2015 Page 2 of 4 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200