VS-HFA08PB60PbF, VS-HFA08PB60-N3 www.vishay.com Vishay Semiconductors HEXFRED Ultrafast Soft Recovery Diode, 8 A FEATURES Ultrafast and ultrasoft recovery Very low I and Q RRM rr Designed and qualified according to 2 JEDEC -JESD 47 3 Material categorization: 1 for definitions of compliance please see TO-247AC modied www.vishay.com/doc 99912 Available Base common BENEFITS cathode Reduced RFI and EMI Reduced power loss in diode and switching transistor 2 Higher frequency operation Reduced snubbing Reduced parts count 1 3 Cathode Anode DESCRIPTION VS-HFA08PB60... is a state of the art center tap ultrafast recovery diode. Employing the latest in epitaxial construction and advanced processing techniques it features a superb combination of characteristics which result in performance which is unsurpassed by any rectifier PRODUCT SUMMARY previously available. With basic ratings of 600 V and 8 A Package TO-247AC modified (2 pins) continuous current, the VS-HFA08PB60... is especially well suited for use as the companion diode for IGBTs and I 8 A F(AV) MOSFETs. In addition to ultrafast recovery time, the V 600 V R HEXFRED product line features extremely low values of V at I 1.4 V peak recovery current (I ) and does not exhibit any F F RRM tendency to snap-off during the t portion of recovery. The b t typ. 18 ns rr HEXFRED features combine to offer designers a rectifier T max. 150 C J with lower noise and significantly lower switching losses in both the diode and the switching transistor. These Diode variation Single die HEXFRED advantages can help to significantly reduce snubbing, component count and heatsink sizes. The HEXFRED VS-HFA08PB60... is ideally suited for applications in power supplies and power conversion systems (such as inverters), motor drives, and many other similar applications where high speed, high efficiency is needed. ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOLTEST CONDITIONSVALUESUNITS Cathode to anode voltage V 600 V R Maximum continuous forward current I T = 100 C 8 F C Single pulse forward current I 60 A FSM Maximum repetitive forward current I 24 FRM T = 25 C 36 C Maximum power dissipation P W D T = 100 C 14 C Operating junction and storage temperature range T , T -55 to +150 C J Stg Revision: 20-Apr-16 Document Number: 94041 1 For technical questions within your region: DiodesAmericas vishay.com, DiodesAsia vishay.com, DiodesEurope vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000VS-HFA08PB60PbF, VS-HFA08PB60-N3 www.vishay.com Vishay Semiconductors ELECTRICAL SPECIFICATIONS (T = 25 C unless otherwise specified) J PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS Cathode to anode V I = 100 A 600 - - BR R breakdown voltage I = 8.0 A -1.4 1.7 F V Maximum forward voltage V I = 16 A See fig. 1 - 1.7 2.1 FM F I = 8.0 A, T = 125 C - 1.4 1.7 F J V = V rated -0.3 5.0 R R Maximum reverse I See fig. 2 A RM leakage current T = 125 C, V = 0.8 x V rated - 100 500 J R R Junction capacitance C V = 200 V See fig. 3 - 10 25 pF T R Series inductance L Measured lead to lead 5 mm from package body - 8.0 - nH S DYNAMIC RECOVERY CHARACTERISTICS (T = 25 C unless otherwise specified) J PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS t I = 1.0 A, dI /dt = 200 A/s, V = 30 V - 18 - rr F F R Reverse recovery time t T = 25 C -37 55 ns rr1 J See fig. 5, 10 t T = 125 C - 55 90 rr2 J I T = 25 C - 3.5 5.0 RRM1 J Peak recovery current A See fig. 6 I = 8.0 A I T = 125 C - 4.5 8.0 F RRM2 J dI /dt = 200 A/s F Q T = 25 C - 65 138 Reverse recovery charge rr1 J V = 200 V nC R See fig. 7 Q T = 125 C - 124 360 rr2 J Peak rate of fall of recovery dI /dt1 T = 25 C - 240 - (rec)M J current during t A/s b dI /dt2 T = 125 C - 210 - (rec)M J See fig. 8 THERMAL - MECHANICAL SPECIFICATIONS PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS Lead temperature T 0.063 from case (1.6 mm) for 10 s - - 300 C lead Thermal resistance, R --3.5 JC junction to case Thermal resistance, R Typical socket mount - - 40 K/W JA junction to ambient Thermal resistance, R Mounting surface, flat, smooth and greased - 0.25 - CS case to heatsink -6.0 - g Weight -0.21 - oz. 6.0 12 kgf cm Mounting torque - (5.0) (10) (lbf in) Marking device Case style TO-247AC modified (JEDEC) HFA08PB60 Revision: 20-Apr-16 Document Number: 94041 2 For technical questions within your region: DiodesAmericas vishay.com, DiodesAsia vishay.com, DiodesEurope vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000