X-On Electronics has gained recognition as a prominent supplier of W9864G2JH-6I DRAM across the USA, India, Europe, Australia, and various other global locations. W9864G2JH-6I DRAM are a product manufactured by Winbond. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

W9864G2JH-6I Winbond

W9864G2JH-6I electronic component of Winbond
W9864G2JH-6I Winbond
W9864G2JH-6I DRAM
W9864G2JH-6I  Semiconductors

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Part No. W9864G2JH-6I
Manufacturer: Winbond
Category: DRAM
Description: DRAM 64M, SDR SDRAM, x32, 166MHz, 65nm, Ind temp
Datasheet: W9864G2JH-6I Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 4.865 ea
Line Total: USD 4.86 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Tue. 11 Mar to Mon. 17 Mar
MOQ : 108
Multiples : 1
108 : USD 3.4197

0
Ship by Fri. 07 Mar to Tue. 11 Mar
MOQ : 1
Multiples : 1
1 : USD 4.865
10 : USD 4.094
25 : USD 4.0002
100 : USD 3.5662
216 : USD 3.4122
432 : USD 3.2884
1080 : USD 3.1307
2592 : USD 3.0969
5184 : USD 2.9393

   
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We are delighted to provide the W9864G2JH-6I from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W9864G2JH-6I and other electronic components in the DRAM category and beyond.

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W9864G2JH 512K 4 BANKS 32BITS SDRAM Table of Contents- 1. GENERAL DESCRIPTION ......................................................................................................... 3 2. FEATURES ................................................................................................................................. 3 3. ORDER INFORMATION ............................................................................................................. 3 4. PIN CONFIGURATION ............................................................................................................... 4 5. PIN DESCRIPTION ..................................................................................................................... 5 6. BLOCK DIAGRAM ...................................................................................................................... 6 7. FUNCTIONAL DESCRIPTION .................................................................................................... 7 7.1 Power Up and Initialization ............................................................................................. 7 7.2 Programming Mode Register .......................................................................................... 7 7.3 Bank Activate Command ................................................................................................ 7 7.4 Read and Write Access Modes ...................................................................................... 7 7.5 Burst Read Command .................................................................................................... 8 7.6 Burst Command .............................................................................................................. 8 7.7 Read Interrupted by a Read ........................................................................................... 8 7.8 Read Interrupted by a Write ............................................................................................ 8 7.9 Write Interrupted by a Write ............................................................................................ 8 7.10 Write Interrupted by a Read ............................................................................................ 8 7.11 Burst Stop Command ..................................................................................................... 9 7.12 Addressing Sequence of Sequential Mode .................................................................... 9 7.13 Addressing Sequence of Interleave Mode ...................................................................... 9 7.14 Auto-precharge Command ........................................................................................... 10 7.15 Precharge Command .................................................................................................... 10 7.16 Self Refresh Command ................................................................................................ 10 7.17 Power Down Mode........................................................................................................ 11 7.18 No Operation Command ............................................................................................... 11 7.19 Deselect Command ...................................................................................................... 11 7.20 Clock Suspend Mode .................................................................................................... 11 8. OPERATION MODE ................................................................................................................. 12 8.1 Simplified Stated Diagram ............................................................................................ 13 9. ELECTRICAL CHARACTERISTICS ......................................................................................... 14 9.1 Absolute Maximum Ratings .......................................................................................... 14 9.2 Recommended DC Operating Conditions .................................................................... 14 9.3 Capacitance .................................................................................................................. 15 9.4 DC Characteristics ........................................................................................................ 15 9.5 AC Characteristics and Operating Condition ................................................................ 16 10. TIMING WAVEFORMS ............................................................................................................. 18 10.1 Command Input Timing ................................................................................................ 18 10.2 Read Timing .................................................................................................................. 19 10.3 Control Timing of Input/Output Data ............................................................................. 20 10.4 Mode Register Set Cycle .............................................................................................. 21 Publication Release Date: Mar. 13, 2017 Revision: A03 - 1 - W9864G2JH 11. OPERATING TIMING EXAMPLE ............................................................................................. 22 11.1 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3) ...................................... 22 11.2 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3, Auto-precharge) ........... 23 11.3 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3) ...................................... 24 11.4 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3, Auto-precharge) ........... 25 11.5 Interleaved Bank Write (Burst Length = 8) ................................................................... 26 11.6 Interleaved Bank Write (Burst Length = 8, Auto-precharge) ........................................ 27 11.7 Page Mode Read (Burst Length = 4, CAS Latency = 3)............................................... 28 11.8 Page Mode Read/Write (Burst Length = 8, CAS Latency = 3) ..................................... 29 11.9 Auto-precharge Read (Burst Length = 4, CAS Latency = 3) ........................................ 30 11.10 Auto-precharge Write (Burst Length = 4) .................................................................... 31 11.11 Auto Refresh Cycle ..................................................................................................... 32 11.12 Self Refresh Cycle ....................................................................................................... 33 11.13 Bust Read and Single Write (Burst Length = 4, CAS Latency = 3) ............................. 34 11.14 Power Down Mode ...................................................................................................... 35 11.15 Auto-precharge Timing (Write Cycle) .......................................................................... 36 11.16 Auto-precharge Timing (Read Cycle) .......................................................................... 37 11.17 Timing Chart of Read to Write Cycle ........................................................................... 38 11.18 Timing Chart of Write to Read Cycle ........................................................................... 38 11.19 Timing Chart of Burst Stop Cycle (Burst Stop Command) .......................................... 39 11.20 Timing Chart of Burst Stop Cycle (Precharge Command) .......................................... 39 11.21 CKE/DQM Input Timing (Write Cycle) ......................................................................... 40 11.22 CKE/DQM Input Timing (Read Cycle) ......................................................................... 41 11.23 Power Up and Initialization .......................................................................................... 42 12. PACKAGE SPECIFICATION .................................................................................................... 43 13. REVISION HISTORY ................................................................................................................ 44 Publication Release Date: Mar. 13, 2017 Revision: A03 - 2 -

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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