BGT24LTR22E6327XTSA1 Infineon

BGT24LTR22 BGT24LTR22 Low Power Multichannel 24GHz Radar MMIC for Smart Sensing Applications Features 24 GHz transceiver MMIC (2 TX, 2 RX) Fully integrated low phase noise VCO Medium power amplifier with variable output power Integrated power detectors Homodyne low noise quadrature receivers Configurable analog baseband amplification stages Frequency divider Low power consumption Multimode operation (Master/Slave) Fully ESD protected device Single ended RF terminals Single supply voltage 1.5V WFWLB-52-3 pin plastic package sized 3.63mmx3.63mm Pb-free (RoHS compliant) package Potential Applications Smart home appliances Drone collision avoidance Traffic monitoring Security applications Description BGT24LTR22 is a low power, low noise multi-channel Silicon Germanium transceiver MMIC for 24 GHz radar applications. It provides building blocks for analog signal generation and reception, operating in the frequency range from 24.0 GHz up to 24.25 GHz. Integrated digital blocks controlling the chip are implemented in order to support radar system design. The device is manufactured in Infineons B11HFC BiCMOS technology offering a cutoff frequency higher than 300GHz. It is housed in Infineons plastic embedded Wafer Level Ball Grid Array (eWLB) package which can be processed in standard SMT flow. Datasheet Please read the Important Notice and Warnings at the end of this document V 1.0 www.infineon.com page 1 of 15 2020-01-26 BGT24LTR22 Low Power Multichannel 24GHz Radar MMIC for Smart Sensing Applications Table of Content Table of Content Features ........................................................................................................................................ 1 Potential Applications ..................................................................................................................... 1 Description .................................................................................................................................... 1 Table of Content ............................................................................................................................. 2 1 Electrical Characteristics ........................................................................................................ 3 1.1 Absolute Maximum Ratings .................................................................................................................... 3 1.2 ESD Integrity ............................................................................................................................................ 4 1.3 Power Supply........................................................................................................................................... 4 1.4 TX Section ................................................................................................................................................ 4 1.5 RX Section ................................................................................................................................................ 5 1.6 Frequency Divider ................................................................................................................................... 6 2 SPI Interface .......................................................................................................................... 7 2.1 SPI Timing Requirements........................................................................................................................ 7 3 Block Diagram and Pin Description ........................................................................................... 8 3.1 Block Diagram ......................................................................................................................................... 8 3.2 Pin Out ..................................................................................................................................................... 9 3.3 Pin Definition and Function .................................................................................................................... 9 4 Package Dimensions and Footprint ......................................................................................... 11 Datasheet 2 of 15 V 1.0 2020-01-26