X-On Electronics has gained recognition as a prominent supplier of CY62147EV30LL-45BVXIT SRAM across the USA, India, Europe, Australia, and various other global locations. CY62147EV30LL-45BVXIT SRAM are a product manufactured by Infineon. We provide cost-effective solutions for SRAM, ensuring timely deliveries around the world.

CY62147EV30LL-45BVXIT Infineon

Hot CY62147EV30LL-45BVXIT electronic component of Infineon
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Part No.CY62147EV30LL-45BVXIT
Manufacturer: Infineon
Category: SRAM
Description: SRAM 4Mb 3V 45ns 256K x 16 LP SRAM
Datasheet: CY62147EV30LL-45BVXIT Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 4.8256 ea
Line Total: USD 4.83 
Availability - 7
Ship by Mon. 02 Dec to Fri. 06 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
7
Ship by Mon. 02 Dec to Fri. 06 Dec
MOQ : 1
Multiples : 1
1 : USD 4.8256
10 : USD 4.6215
25 : USD 4.5487
50 : USD 4.4668
100 : USD 4.2939
250 : USD 4.1626
500 : USD 4.0586
1000 : USD 3.9468
2000 : USD 3.6127

1940
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ : 1
Multiples : 1
1 : USD 5.39
10 : USD 4.73
100 : USD 4.477
250 : USD 4.4
500 : USD 4.246
1000 : USD 4.07
2000 : USD 3.85
10000 : USD 3.839

   
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We are delighted to provide the CY62147EV30LL-45BVXIT from our SRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the CY62147EV30LL-45BVXIT and other electronic components in the SRAM category and beyond.

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CY62147EV30 MoBL 4-Mbit (256 K 16) Static RAM 4-Mbit (256 K 16) Static RAM Features Functional Description Very high speed: 45 ns The CY62147EV30 is a high performance CMOS static RAM (SRAM) organized as 256 K words by 16 bits. This device Temperature ranges features advanced circuit design to provide ultra low active Industrial: 40 C to +85 C current. It is ideal for providing More Battery Life (MoBL ) in Wide voltage range: 2.20 V to 3.60 V portable applications such as cellular telephones. The device Pin compatible with CY62147DV30 also has an automatic power down feature that significantly reduces power consumption when addresses are not toggling. Ultra low standby power Placing the device into standby mode reduces power Typical standby current: 1 A consumption by more than 99 percent when deselected (CE Maximum standby current: 7 A (Industrial) HIGH or both BLE and BHE are HIGH). The input and output pins Ultra low active power (I/O through I/O ) are placed in a high impedance state when: 0 15 Typical active current: 2 mA at f = 1 MHz Deselected (CE HIGH) 1 Easy memory expansion with CE and OE features Outputs are disabled (OE HIGH) Automatic power-down when deselected Both Byte High Enable and Byte Low Enable are disabled Complementary metal oxide semiconductor (CMOS) for (BHE, BLE HIGH) optimum speed and power Write operation is active (CE LOW and WE LOW) Available in Pb-free 48-ball very fine ball grid array (VFBGA) To write to the device, take Chip Enable (CE) and Write Enable (single/dual CE option) and 44-pin thin small outline package (WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data (TSOP) II packages from I/O pins (I/O through I/O ) is written into the location 0 7 Byte power-down feature specified on the address pins (A through A ). If Byte High 0 17 Enable (BHE) is LOW, then data from I/O pins (I/O through 8 I/O ) is written into the location specified on the address pins 15 (A through A ). 0 17 To read from the device, take Chip Enable (CE) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low enable (BLE) is LOW, then data from the memory location specified by the address pins appear on I/O to I/O . If 0 7 Byte High enable (BHE) is LOW, then data from memory appears on I/O to I/O . See the Truth Table on page 11 for a complete 8 15 description of read and write modes. For a complete list of related documentation, click here. Logic Block Diagram DATA IN DRIVERS A 10 A 9 A 8 A 7 A 6 256K x 16 A 5 I/O I/O 0 7 A RAM Array 4 A 3 I/O I/O 8 15 A 2 A 1 A 0 COLUMN DECODER BHE CE POWER DOWN WE BHE 1 CIRCUIT CE BLE OE BLE Note 1. BGA packaged device is offered in single CE and dual CE options. In this data sheet, for a dual CE device, CE refers to the internal logical combination of CE and 1 CE such that when CE is LOW and CE is HIGH, CE is LOW. For all other cases CE is HIGH. 2 1 2 Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600 Document Number: 38-05440 Rev. *O Revised November 28, 2014 ROW DECODER A 11 A 12 A 13 A 14 A 15 A 16 A 17 SENSE AMPS CY62147EV30 MoBL Contents Product Portfolio ..............................................................3 Ordering Information ...................................................... 12 Pin Configurations ...........................................................3 Ordering Code Definitions ......................................... 12 Maximum Ratings .............................................................4 Package Diagrams .......................................................... 13 Operating Range ...............................................................4 Acronyms ........................................................................15 Electrical Characteristics .................................................4 Document Conventions ................................................. 15 Capacitance ......................................................................5 Units of Measure ....................................................... 15 Thermal Resistance ..........................................................5 Document History Page ................................................. 16 AC Test Load and Waveforms .........................................5 Sales, Solutions, and Legal Information ...................... 18 Data Retention Characteristics .......................................6 Worldwide Sales and Design Support ....................... 18 Data Retention Waveform ................................................6 Products ....................................................................18 Switching Characteristics ................................................7 PSoC Solutions ...................................................... 18 Switching Waveforms ......................................................8 Cypress Developer Community ................................. 18 Truth Table ......................................................................11 Technical Support ..................................................... 18 Document Number: 38-05440 Rev. *O Page 2 of 18

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
Cypress
Cypress / Spansion
CYPRESS SEMI
Cypress Semicon
Cypress Semiconductor
Cypress Semiconductor Corp
INF
INFINEON
Infineon IR
INFINEON (CYPRESS)
Infineon (IRF)
Infineon / Cypress
Infineon / IR
INFINEON TECH ICs
Infineon Technologies
INFINEON TECHNOLOGIES AG
Infineon Technologies Americas Corp.
Infinite Power Solutions
INTERNATIONAL RECTIF
INTERNATIONAL RECTIFIER
International Rectifier HiRel Products
INTL RECTIFIER
IR
IRH
Ramtron
Ramtron / Cypress Semiconductor
Ramtron International Corp
SP9
SPANSION
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