X-On Electronics has gained recognition as a prominent supplier of CY62147G30-45ZSXIES SRAM across the USA, India, Europe, Australia, and various other global locations. CY62147G30-45ZSXIES SRAM are a product manufactured by Infineon. We provide cost-effective solutions for SRAM, ensuring timely deliveries around the world.

CY62147G30-45ZSXIES Infineon

CY62147G30-45ZSXIES electronic component of Infineon
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Part No.CY62147G30-45ZSXIES
Manufacturer: Infineon
Category: SRAM
Description: Cypress Semiconductor SRAM MoBL SRAM 4-Mbit
Datasheet: CY62147G30-45ZSXIES Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
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Obsolete
Availability Price Quantity
0
MOQ : 1
Multiples : 1
1 : USD 7.9959
10 : USD 5.3967
25 : USD 5.2976
50 : USD 5.2535
100 : USD 4.7689
250 : USD 4.7469
500 : USD 4.5267
1000 : USD 4.2954
5000 : USD 4.1742
N/A

Obsolete
   
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We are delighted to provide the CY62147G30-45ZSXIES from our SRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the CY62147G30-45ZSXIES and other electronic components in the SRAM category and beyond.

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CY62147G/CY621472G CY62147GE MoBL 4-Mbit (256K words 16-bit) Static RAM with Error-Correcting Code (ECC) 4-Mbit (256K words 16-bit) Static RAM with Error-Correcting Code (ECC) Data writes are performed by asserting the Write Enable (WE) Features input LOW, while providing the data on I/O through I/O and 0 15 High speed: 45 ns/55 ns address on A through A pins. The Byte High Enable (BHE) 0 17 and Byte Low Enable (BLE) inputs control write operations to the Ultra-low standby power upper and lower bytes of the specified memory location. BHE Typical standby current: 3.5 A controls I/O through I/O and BLE controls I/O through I/O . 8 15 0 7 Maximum standby current: 8.7 A Data reads are performed by asserting the Output Enable (OE) 1, 2 Embedded ECC for single-bit error correction input and providing the required address on the address lines. Wide voltage range: 1.65 V to 2.2 V, 2.2 V to 3.6 V, and 4.5 V Read data is accessible on the I/O lines (I/O through I/O ). 0 15 to 5.5 V Byte accesses can be performed by asserting the required byte enable signal (BHE or BLE) to read either the upper byte or the 1.0-V data retention lower byte of data from the specified address location. TTL-compatible inputs and outputs All I/Os (I/O through I/O ) are placed in a HI-Z state when the 0 15 Error indication (ERR) pin to indicate 1-bit error detection and device is deselected (CE HIGH for a single chip enable device correction and CE HIGH/CE LOW for a dual chip enable device), or 1 2 control signals are de-asserted (OE, BLE, BHE). Pb-free 48-ball VFBGA and 44-pin TSOP II packages The device also has a unique Byte Power down feature, where, Functional Description if both the Byte Enables (BHE and BLE) are disabled, the devices seamlessly switch to standby mode irrespective of the CY62147G and CY62147GE are high-performance CMOS state of the chip enables, thereby saving power. low-power (MoBL) SRAM devices with embedded ECC. Both devices are offered in single and dual chip enable options and in On the CY62147GE devices, the detection and correction of a multiple pin configurations. The CY62147GE device includes an single-bit error in the accessed location is indicated by the 1 ERR pin that signals an error-detection and correction event assertion of the ERR output (ERR = HIGH) . See the Truth during a read cycle. Table CY62147G/CY62147GE on page 16 for a complete description of read and write modes. Devices with a single chip enable input are accessed by asserting the chip enable (CE) input LOW. Dual chip enable The logic block diagrams are on page 2. devices are accessed by asserting both chip enable inputs CE 1 as low and CE as HIGH. 2 Product Portfolio Power Dissipation Features and Options Operating I , (mA) CC 3 Standby, I (A) SB2 Product Range V Range (V) Speed (ns) (see the Pin CC f = f max Configurations 4 4 Typ Max Typ Max section) CY62147G(E)18 Industrial 1.65 V2.2 V 55 15 20 3.5 10 Single or dual CY62147G(E)30 Chip Enables 2.2 V3.6 V 45 15 20 3.5 8.7 CY621472G30 Optional ERR CY62147G(E) 4.5 V5.5 V pin Notes 1. This device does not support automatic write-back on error detection. 2. SER FIT Rate <0.1 FIT/Mb. Refer AN88889 for details. 3. The ERR pin is available only for devices which have ERR option E in the ordering code. Refer Ordering Information on page 17. 4. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V = 1.8 V (for a V range of 1.65 V2.2 V), CC CC V =3V (for V range of 2.2 V3.6 V), and V = 5 V (for V range of 4.5 V5.5 V), T = 25 C. CC CC CC CC A Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600 Document Number: 001-92847 Rev. *K Revised July 13, 2018CY62147G/CY621472G CY62147GE MoBL Logic Block Diagram CY62147G ECCENCODER INPUTBUFFER A0 A1 A2 A3 I/O I/O MEMORY 0 7 A4 ARRAY A5 I/O I/O 8 15 A6 A7 A8 A9 COLUMNDECODER BHE WE CE 2 OE CE 1 BLE Logic Block Diagram CY62147GE ECCENCODER INPUTBUFFER A0 A1 ERR A2 A3 I/O I/O MEMORY 0 7 A4 ARRAY I/O I/O A5 8 15 A6 A7 A8 A9 COLUMNDECODER BHE WE CE 2 CE 1 OE BLE Document Number: 001-92847 Rev. *K Page 2 of 22 ROWDECODER A10 ROWDECODER A11 A12 A13 A10 A14 A11 A15 A12 A16 A13 A17 A14 A15 SENSE A16 A17 AMPLIFIERS SENSE ECCDECODER AMPLIFIERS ECCDECODER

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
Cypress
Cypress / Spansion
CYPRESS SEMI
Cypress Semicon
Cypress Semiconductor
Cypress Semiconductor Corp
INF
INFINEON
Infineon IR
INFINEON (CYPRESS)
Infineon (IRF)
Infineon / Cypress
Infineon / IR
INFINEON TECH ICs
Infineon Technologies
INFINEON TECHNOLOGIES AG
Infineon Technologies Americas Corp.
Infinite Power Solutions
INTERNATIONAL RECTIF
INTERNATIONAL RECTIFIER
International Rectifier HiRel Products
INTL RECTIFIER
IR
IRH
Ramtron
Ramtron / Cypress Semiconductor
Ramtron International Corp
SP9
SPANSION

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