Application Note Datum: 8/15/2005-07-18 Seite 1 AN2005-06 Soldering of TM TM EconoPACK , EconoPIM , TM EconoBRIDGE , EconoPACK+, EconoDUAL, EasyPACK and TM EasyPIM - Modules Soldering with alloys containing lead (SnPb) is the standard connection technology for the general electrical and electronics industry until today. The soldering processes have been acquired, developed and improved over decades. This means: All components used, such as devices, circuit boards and aiding materials are tuned for plumbiferous soldering. Soldering is differentiated between soft and hard soldering. In soft soldering maximum operating temperatures of approximately 450C are applied. For hard soldering the operating temperature is above this value. The solder is usually an alloy of two or more metals and it joins metals under the influence of the applied temperature. The temperature melts the solder, however, not the metals to be joined. A good solder has the following properties: The solder should easily flow onto the metals at the given temperatures, should wet the metal and join with the metal surface to form an alloy with it. Rigidity should be as great as possible without becoming brittle. eupec GmbH Max-Planck-Strae D-59581 Warstein Tel. +49 (0) 29 02 7 64-0 Fax + 49 (0) 29 02 7 64-12 56 info eupec.com www.eupec.com Author: Robert Severin Application Note Datum: 8/15/2005-07-18 Seite 2 AN2005-06 Solder process The common soldering is a way to join electrically conducting metals. In the most simple and conventional soldering process one requires a soldering iron, solder and flux. Flux is applied to the metals to be joined, the soldering iron heats up the parts to be soldered, the solder is applied and thus the soldering is achieved. (Fig a) In an optimised process the metals to be joined are heated up with the soldering iron. The improved hollow solder with a flux core is applied to the point of contact. The melting point of the solder is around 180C to 200C. Resin and colophony are used as flux in these cored solders. The purpose of the flux is to dissolve oxides and to prevent further oxidisation during the solder process. manual soldering iron solder roll solder tip PCB module heat sink Fig a) manual soldering eupec GmbH Max-Planck-Strae D-59581 Warstein Tel. +49 (0) 29 02 7 64-0 Fax + 49 (0) 29 02 7 64-12 56 info eupec.com www.eupec.com Author: Robert Severin