X-On Electronics has gained recognition as a prominent supplier of FS660R08A6P2FBBPSA1 IGBT Modules across the USA, India, Europe, Australia, and various other global locations. FS660R08A6P2FBBPSA1 IGBT Modules are a product manufactured by Infineon. We provide cost-effective solutions for IGBT Modules, ensuring timely deliveries around the world.

FS660R08A6P2FBBPSA1 Infineon

FS660R08A6P2FBBPSA1 electronic component of Infineon
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Part No.FS660R08A6P2FBBPSA1
Manufacturer: Infineon
Category: IGBT Modules
Description: IGBT Module N-Channel 750V 450A 20V Tray
Datasheet: FS660R08A6P2FBBPSA1 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 424.523 ea
Line Total: USD 424.52 
Availability - 1
Ship by Wed. 25 Dec to Fri. 27 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
1
Ship by Wed. 25 Dec to Fri. 27 Dec
MOQ : 1
Multiples : 1
1 : USD 424.523
12 : USD 424.512

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Product
Configuration
Collector- Emitter Voltage VCEO Max
Collector-Emitter Saturation Voltage
Continuous Collector Current at 25 C
Gate-Emitter Leakage Current
Maximum Operating Temperature
Minimum Operating Temperature
Packaging
Pd - Power Dissipation
Technology
Brand
Mounting Style
Maximum Gate Emitter Voltage
Product Type
Factory Pack Quantity :
Subcategory
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the FS660R08A6P2FBBPSA1 from our IGBT Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the FS660R08A6P2FBBPSA1 and other electronic components in the IGBT Modules category and beyond.

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HybridPACK Drive Module FS660R08A6P2FB Final Data Sheet V3.0, 2019-05-20 Automotive High PowerFS660R08A6P2FB HybridPACK Drive Module 1 Features / Description HybridPACK Drive module with EDT2 IGBT and Diode T T T VCES = 750 V I = 660 A C Typical Applications Description TM Automotive Applications The HybridPACK Drive is a very compact six-pack module optimized for hybrid and electric Hybrid Electrical Vehicles (H)EV vehicles. The product FS660R08A6P2FB comes Motor Drives with a flat baseplate and is a 750V/660A module Commercial Agriculture Vehicles derivate within the HybridPACK Drive family. The power module implements the new EDT2 IGBT generation, which is an automotive Micro-Pattern Electrical Features Trench-Field-Stop cell design optimized for electric Blocking voltage 750V drive train applications. The chipset has benchmark current density combined with short circuit Low V CEsat ruggedness and increased blocking voltage for Low Switching Losses reliable inverter operation under harsh Low Qg and Crss environmental conditions. The EDT2 IGBTs also Low Inductive Design show excellent light load power losses, which helps to improve system efficiency over a real driving Tvj op = 150C cycle. The EDT2 IGBT was optimized for Short-time extended Operation Temperature applications with switching frequencies in the range Tvj op = 175C of 10 kHz. TM The new The HybridPACK Drive power module Mechanical Features family comes with mechanical guiding elements 4.2kV DC 1sec Insulation supporting easy assembly processes for customers. High Creepage and Clearance Distances Furthermore, the press-fit pins for the signal Compact design terminals avoid additional time consuming selective solder processes, which provides cost savings on High Power Density system level and increases system reliability. The Copper Base Plate TM two products in the The HybridPACK Drive family Guiding elements for PCB and cooler assembly with flat baseplate in the FS660R08A6P2FB and Integrated NTC temperature sensor PinFin baseplate in the FS820R08A6P2B allow a very cost effective scaling for different inverter PressFIT Contact Technology power levels at a minimum inverter design effort. RoHS compliant UL 94 V0 module frame Product Name Ordering Code FS660R08A6P2FB SP001632426 Final Data Sheet 2 V3.0, 2019-05-20

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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