FS660R08A6P2FLBBPSA1 Infineon

HybridPACK Drive Module FS660R08A6P2FLB Final Data Sheet V3.0, 2019-05-20 Automotive High PowerFS660R08A6P2FLB HybridPACK Drive Module 1 Features / Description HybridPACK Drive module with EDT2 IGBT and Diode T T T VCES = 750 V I = 660 A C Typical Applications Description TM Automotive Applications The HybridPACK Drive is a very compact six-pack module optimized for hybrid and electric Hybrid Electrical Vehicles (H)EV vehicles. The product FS660R08A6P2FLB comes Motor Drives with a flat baseplate and is a 750V/660A module Commercial Agriculture Vehicles derivate within the HybridPACK Drive family. The power module implements the new EDT2 IGBT generation, which is an automotive Micro-Pattern Electrical Features Trench-Field-Stop cell design optimized for electric Blocking voltage 750V drive train applications. The chipset has benchmark current density combined with short circuit Low V CEsat ruggedness and increased blocking voltage for Low Switching Losses reliable inverter operation under harsh Low Qg and Crss environmental conditions. The EDT2 IGBTs also Low Inductive Design show excellent light load power losses, which helps to improve system efficiency over a real driving Tvj op = 150C cycle. The EDT2 IGBT was optimized for Short-time extended Operation Temperature applications with switching frequencies in the range Tvj op = 175C of 10 kHz. TM The new The HybridPACK Drive power module Mechanical Features family comes with mechanical guiding elements 4.2kV DC 1sec Insulation supporting easy assembly processes for customers. High Creepage and Clearance Distances Furthermore, the press-fit pins for the signal Compact design terminals avoid additional time consuming selective solder processes, which provides cost savings on High Power Density system level and increases system reliability. The Copper Base Plate TM two products in the The HybridPACK Drive family Guiding elements for PCB and cooler assembly with flat baseplate in the FS660R08A6P2FLB and Integrated NTC temperature sensor PinFin baseplate in the FS820R08A6P2LB allow a very cost effective scaling for different inverter PressFIT Contact Technology power levels at a minimum inverter design effort. RoHS compliant UL 94 V0 module frame Product Name Ordering Code FS660R08A6P2FLB SP001850450 Final Data Sheet 2 V3.0, 2019-05-20