X-On Electronics has gained recognition as a prominent supplier of FS820R08A6P2LBBPSA1 IGBT Modules across the USA, India, Europe, Australia, and various other global locations. FS820R08A6P2LBBPSA1 IGBT Modules are a product manufactured by Infineon. We provide cost-effective solutions for IGBT Modules, ensuring timely deliveries around the world.

FS820R08A6P2LBBPSA1 Infineon

FS820R08A6P2LBBPSA1 electronic component of Infineon
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Part No.FS820R08A6P2LBBPSA1
Manufacturer: Infineon
Category: IGBT Modules
Description: IGBT Modules HYBRID PACK DRIVE
Datasheet: FS820R08A6P2LBBPSA1 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 552.3557 ea
Line Total: USD 552.36 
Availability - 32
Ship by Thu. 26 Dec to Mon. 30 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
32
Ship by Thu. 26 Dec to Mon. 30 Dec
MOQ : 1
Multiples : 1
1 : USD 552.3557
12 : USD 548.8676

   
Manufacturer
Product Category
Product
Configuration
Collector- Emitter Voltage VCEO Max
Collector-Emitter Saturation Voltage
Continuous Collector Current at 25 C
Gate-Emitter Leakage Current
Maximum Operating Temperature
Minimum Operating Temperature
Packaging
Pd - Power Dissipation
Hts Code
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the FS820R08A6P2LBBPSA1 from our IGBT Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the FS820R08A6P2LBBPSA1 and other electronic components in the IGBT Modules category and beyond.

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HybridPACK Drive Module FS820R08A6P2LB Final Data Sheet V3.4, 2019-10-09 Automotive High PowerFS820R08A6P2LB HybridPACK Drive Module 1 Features / Description HybridPACK Drive module with EDT2 IGBT and Diode T T T VCES = 750 V I = 820 A C Typical Applications Description TM Automotive Applications The HybridPACK Drive is a very compact six-pack module (750V/820A) optimized for hybrid Hybrid Electrical Vehicles (H)EV and electric vehicles. The power module Motor Drives implements the new EDT2 IGBT generation, which Commercial Agriculture Vehicles is an automotive Micro-Pattern Trench-Field-Stop cell design optimized for electric drive train applications. The chipset has benchmark current Electrical Features density combined with short circuit ruggedness and Blocking voltage 750V increased blocking voltage for reliable inverter operation under harsh environmental conditions. Low V CEsat The EDT2 IGBTs also show excellent light load Low Switching Losses power losses, which helps to improve system Low Qg and Crss efficiency over a real driving cycle. The EDT2 IGBT Low Inductive Design was optimized for applications with switching frequencies in the range of 10 kHz. Tvj op = 150C Short-time extended Operation Temperature TM The new HybridPACK Drive power module family Tvj op = 175C comes with mechanical guiding elements supporting easy assembly processes for customers. Furthermore, the press-fit pins for the signal Mechanical Features terminals avoid additional time consuming selective 4.2kV DC 1sec Insulation solder processes, which provides cost savings on High Creepage and Clearance Distances system level and increases system reliability. The Compact design direct cooled baseplate with PinFin structure in the FS820R08A6P2LB product best utilizes the High Power Density implemented chipset and shows superior thermal Direct Cooled PinFin Base Plate characteristics. Due to the high clearance & Guiding elements for PCB and cooler assembly creepage distances, the module family is also well Integrated NTC temperature sensor suited for increased system working voltages and supports modular inverter approaches. PressFIT Contact Technology RoHS compliant UL 94 V0 module frame Product Name Ordering Code FS820R08A6P2LB SP001611366 Final Data Sheet 2 V3.4, 2019-10-09

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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