X-On Electronics has gained recognition as a prominent supplier of FZ800R12KS4_B2 IGBT Modules across the USA, India, Europe, Australia, and various other global locations. FZ800R12KS4_B2 IGBT Modules are a product manufactured by Infineon. We provide cost-effective solutions for IGBT Modules, ensuring timely deliveries around the world.

FZ800R12KS4_B2 Infineon

FZ800R12KS4_B2 electronic component of Infineon
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Part No.FZ800R12KS4_B2
Manufacturer: Infineon
Category: IGBT Modules
Description: IGBT Modules N-CH 1.2KV 1.2KA
Datasheet: FZ800R12KS4_B2 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 1
Multiples : 1
1 : USD 1136.3696
5 : USD 1127.4668
10 : USD 1118.5866
25 : USD 1101.1309
50 : USD 1092.2507
100 : USD 1058.2307
250 : USD 1057.6779
500 : USD 1057.6666
1000 : USD 1057.1249
N/A

Obsolete
   
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We are delighted to provide the FZ800R12KS4_B2 from our IGBT Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the FZ800R12KS4_B2 and other electronic components in the IGBT Modules category and beyond.

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Technische Information / Technical Information IGBT-Module FZ800R12KS4 B2 IGBT-modules Hochleistungsmodul mit AlSiC Bodenplatte und schnellem IGBT2 fr hochfrequentes Schalten High Power Module with AlSiC base plate and short tail IGBT2 for high switching frequency IGBT,Wechselrichter / IGBT,Inverter Hchstzulssige Werte / Maximum Rated Values Kollektor-Emitter-Sperrspannung T = 25C V 1200 V vj CES Collector-emitter voltage Kollektor-Dauergleichstrom T = 80C, T = 150C I 800 A C vj max C nom Continuous DC collector current TC = 25C, Tvj max = 150C IC 1200 A Periodischer Kollektor-Spitzenstrom t = 1 ms I 1600 A P CRM Repetitive peak collector current Gesamt-Verlustleistung T = 25C, T = 150C P 7,60 kW C vj max tot Total power dissipation Gate-Emitter-Spitzenspannung VGES +/-20 V Gate-emitter peak voltage Charakteristische Werte / Characteristic Values min. typ. max. Kollektor-Emitter-Sttigungsspannung I = 800 A, V = 15 V T = 25C 3,20 3,70 V C GE vj V CE sat Collector-emitter saturation voltage I = 800 A, V = 15 V T = 125C 3,85 V C GE vj Gate-Schwellenspannung IC = 32,0 mA, VCE = VGE, Tvj = 25C VGEth 4,5 5,5 6,5 V Gate threshold voltage Gateladung V = -15 V ... +15 V, V = 600V Q 8,40 C GE CE G Gate charge Interner Gatewiderstand Tvj = 25C RGint 0,56 Internal gate resistor Eingangskapazitt f = 1 MHz, T = 25C, V = 25 V, V = 0 V C 52,0 nF vj CE GE ies Input capacitance Rckwirkungskapazitt f = 1 MHz, Tvj = 25C, VCE = 25 V, VGE = 0 V Cres 3,40 nF Reverse transfer capacitance Kollektor-Emitter-Reststrom V = 1200 V, V = 0 V, T = 25C I 5,0 mA CE GE vj CES Collector-emitter cut-off current Gate-Emitter-Reststrom V = 0 V, V = 20 V, T = 25C I 400 nA CE GE vj GES Gate-emitter leakage current Einschaltverzgerungszeit, induktive Last IC = 800 A, VCE = 600 V Tvj = 25C 0,10 s t d on Turn-on delay time, inductive load V = 15 V T = 125C 0,125 s GE vj RGon = 1,3 Anstiegszeit, induktive Last IC = 800 A, VCE = 600 V Tvj = 25C 0,09 s t r Rise time, inductive load V = 15 V T = 125C 0,10 s GE vj RGon = 1,3 Abschaltverzgerungszeit, induktive Last IC = 800 A, VCE = 600 V Tvj = 25C 0,53 s t d off Turn-off delay time, inductive load V = 15 V T = 125C 0,59 s GE vj RGoff = 1,3 Fallzeit, induktive Last IC = 800 A, VCE = 600 V Tvj = 25C 0,06 s t f Fall time, inductive load V = 15 V T = 125C 0,07 s GE vj RGoff = 1,3 Einschaltverlustenergie pro Puls IC = 800 A, VCE = 600 V, LS = 60 nH Tvj = 25C mJ Turn-on energy loss per pulse V = 15 V T = 125C E 76,0 mJ GE vj on RGon = 1,3 Abschaltverlustenergie pro Puls IC = 800 A, VCE = 600 V, LS = 60 nH Tvj = 25C mJ Turn-off energy loss per pulse V = 15 V T = 125C E 58,0 mJ GE vj off RGoff = 1,3 Kurzschluverhalten VGE 15 V, VCC = 900 V I SC SC data V = V -L di/dt t 10 s, T = 125C 6000 A CEmax CES sCE P vj Wrmewiderstand, Chip bis Gehuse pro IGBT / per IGBT R 16,5 K/kW thJC Thermal resistance, junction to case Wrmewiderstand, Gehuse bis Khlkrper pro IGBT / per IGBT R 13,5 K/kW thCH Thermal resistance, case to heatsink = 1 W/(mK) / = 1 W/(mK) Paste grease Temperatur im Schaltbetrieb T -40 125 C vj op Temperature under switching conditions prepared by: WB date of publication: 2013-11-25 approved by: PL revision: 3.2 1Technische Information / Technical Information IGBT-Module FZ800R12KS4 B2 IGBT-modules Diode, Wechselrichter / Diode, Inverter Hchstzulssige Werte / Maximum Rated Values Periodische Spitzensperrspannung T = 25C V 1200 V vj RRM Repetitive peak reverse voltage Dauergleichstrom I 800 A F Continuous DC forward current Periodischer Spitzenstrom t = 1 ms I 1600 A P FRM Repetitive peak forward current Grenzlastintegral V = 0 V, t = 10 ms, T = 125C It 185 kAs R P vj It - value Charakteristische Werte / Characteristic Values min. typ. max. Durchlassspannung I = 800 A, V = 0 V T = 25C 2,00 2,40 V F GE vj VF Forward voltage I = 800 A, V = 0 V T = 125C 1,70 V F GE vj Rckstromspitze I = 800 A, - di /dt = 8200 A/s (T =125C) T = 25C 540 A F F vj vj Peak reverse recovery current V = 600 V T = 125C I 900 A R vj RM V = -15 V GE Sperrverzgerungsladung I = 800 A, - di /dt = 8200 A/s (T =125C) T = 25C 60,0 C F F vj vj Recovered charge V = 600 V T = 125C Q 160 C R vj r V = -15 V GE Abschaltenergie pro Puls I = 800 A, - di /dt = 8200 A/s (T =125C) T = 25C 32,0 mJ F F vj vj Reverse recovery energy V = 600 V T = 125C E 76,0 mJ R vj rec V = -15 V GE Wrmewiderstand, Chip bis Gehuse pro Diode / per diode R 25,0 K/kW thJC Thermal resistance, junction to case Wrmewiderstand, Gehuse bis Khlkrper pro Diode / per diode RthCH 20,0 K/kW Thermal resistance, case to heatsink = 1 W/(mK) / = 1 W/(mK) Paste grease Temperatur im Schaltbetrieb T -40 125 C vj op Temperature under switching conditions prepared by: WB date of publication: 2013-11-25 approved by: PL revision: 3.2 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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