Technische Information / Technical Information IGBT-Module IFS100B12N3E4 B31 IGBT-modules MIPAQbase Modul mit Trench/Feldstopp IGBT4 und Emitter Controlled HE Diode und Strommesswiderstand MIPAQbase module with Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and current sense shunt Vorlufige Daten / Preliminary Data J V = 1200V CES I = 100A / I = 200A C nom CRM Typische Anwendungen Typical Applications Motorantriebe Motor Drives Servoumrichter Servo Drives Elektrische Eigenschaften Electrical Features Niedrige Schaltverluste Low Switching Losses Tvj op = 150C Tvj op = 150C Niedriges V Low V CEsat CEsat Mechanische Eigenschaften Mechanical Features Hohe Last- und thermische Wechselfestigkeit High Power and Thermal Cycling Capability Isolierte Bodenplatte Isolated Base Plate Kupferbodenplatte Copper Base Plate Standardgehuse Standard Housing Module Label Code Barcode Code 128 Content of the Code Digit Module Serial Number 1 - 5 Module Material Number 6 - 11 Production Order Number 12 - 19 DMX - Code Datecode (Production Year) 20 - 21 Datecode (Production Week) 22 - 23 prepared by: CM date of publication: 2013-03-06 approved by: MS revision: 2.0 1Technische Information / Technical Information IGBT-Module IFS100B12N3E4 B31 IGBT-modules Vorlufige Daten Preliminary Data IGBT,Wechselrichter / IGBT,Inverter Hchstzulssige Werte / Maximum Rated Values Kollektor-Emitter-Sperrspannung T = 25C V 1200 V vj CES Collector-emitter voltage Kollektor-Dauergleichstrom T = 95C, T = 175C I 100 A C vj C nom Continuous DC collector current Periodischer Kollektor-Spitzenstrom t = 1 ms I 200 A P CRM Repetitive peak collector current Gesamt-Verlustleistung T = 25C, T = 175C P 515 W C vj tot Total power dissipation Gate-Emitter-Spitzenspannung VGES +/-20 V Gate-emitter peak voltage Charakteristische Werte / Characteristic Values min. typ. max. Kollektor-Emitter-Sttigungsspannung I = 100 A, V = 15 V T = 25C 1,75 2,10 V C GE vj Collector-emitter saturation voltage I = 100 A, V = 15 V T = 125C V 2,00 V C GE vj CE sat I = 100 A, V = 15 V T = 150C 2,05 V C GE vj Gate-Schwellenspannung I = 4,00 mA, V = V , T = 25C V 5,2 5,8 6,4 V C CE GE vj GEth Gate threshold voltage Gateladung VGE = -15 V ... +15 V QG 0,80 C Gate charge Interner Gatewiderstand T = 25C R 7,5 vj Gint Internal gate resistor Eingangskapazitt f = 1 MHz, Tvj = 25C, VCE = 25 V, VGE = 0 V Cies 6,30 nF Input capacitance Rckwirkungskapazitt f = 1 MHz, T = 25C, V = 25 V, V = 0 V C 0,27 nF vj CE GE res Reverse transfer capacitance Kollektor-Emitter-Reststrom VCE = 1200 V, VGE = 0 V, Tvj = 25C ICES 1,0 mA Collector-emitter cut-off current Gate-Emitter-Reststrom V = 0 V, V = 20 V, T = 25C I 100 nA CE GE vj GES Gate-emitter leakage current Einschaltverzgerungszeit, induktive Last I = 100 A, V = 600 V T = 25C 0,16 s C CE vj t d on Turn-on delay time, inductive load VGE = 15 V Tvj = 125C 0,17 s R = 1,6 T = 150C 0,18 s Gon vj Anstiegszeit, induktive Last I = 100 A, V = 600 V T = 25C 0,025 s C CE vj t r Rise time, inductive load VGE = 15 V Tvj = 125C 0,03 s R = 1,6 T = 150C 0,03 s Gon vj Abschaltverzgerungszeit, induktive Last I = 100 A, V = 600 V T = 25C 0,37 s C CE vj t d off Turn-off delay time, inductive load VGE = 15 V Tvj = 125C 0,45 s R = 1,6 T = 150C 0,48 s Goff vj Fallzeit, induktive Last I = 100 A, V = 600 V T = 25C 0,06 s C CE vj t f Fall time, inductive load VGE = 15 V Tvj = 125C 0,11 s R = 1,6 T = 150C 0,13 s Goff vj Einschaltverlustenergie pro Puls I = 100 A, V = 600 V, L = 40 nH T = 25C 4,00 mJ C CE S vj Turn-on energy loss per pulse VGE = 15 V, di/dt = 3700 A/s (Tvj=150C) Tvj = 125C Eon 6,50 mJ R = 1,6 T = 150C 7,50 mJ Gon vj Abschaltverlustenergie pro Puls I = 100 A, V = 600 V, L = 40 nH T = 25C 7,60 mJ C CE S vj Turn-off energy loss per pulse VGE = 15 V, du/dt = 3400 V/s (Tvj=150C) Tvj = 125C Eoff 11,0 mJ R = 1,6 T = 150C 12,5 mJ Goff vj Kurzschluverhalten V 15 V, V = 800 V GE CC ISC SC data VCEmax = VCES -LsCE di/dt tP 10 s, Tvj = 150C 400 A Wrmewiderstand, Chip bis Gehuse pro IGBT / per IGBT R 0,29 K/W thJC Thermal resistance, junction to case Wrmewiderstand, Gehuse bis Khlkrper pro IGBT / per IGBT R 0,086 K/W thCH Thermal resistance, case to heatsink Paste = 1 W/(mK) / grease = 1 W/(mK) prepared by: CM date of publication: 2013-03-06 approved by: MS revision: 2.0 2