BFU630F,115 NXP

BFU630F NPN wideband silicon RF transistor Rev. 1 15 December 2010 Product data sheet 1. Product profile 1.1 General description NPN silicon microwave transistor for high speed, low noise applications in a plastic, 4-pin dual-emitter SOT343F package. CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. 1.2 Features and benefits Low noise high gain microwave transistor Noise figure (NF) = 0.85 dB at 2.4 GHz High maximum stable gain 26 dB at 1.8 GHz 40 GHz f silicon technology T 1.3 Applications Low noise amplifiers for microwave communications systems WLAN and CDMA applications Analog/digital cordless applications Ku band oscillators DROs LNB RKE AMR GPS ZigBee LTE, cellular, UMTS FM radio Mobile TV BluetoothBFU630F NXP Semiconductors NPN wideband silicon RF transistor 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V collector-base voltage open emitter - - 16 V CBO V collector-emitter voltage open base - - 5.5 V CEO V emitter-base voltage open collector - - 2.5 V EBO I collector current - 3 30 mA C 1 P total power dissipation T 90 C - - 200 mW tot sp h DC current gain I =5mA V =2V 90 135 180 FE C CE T =25 C j C collector-base V =2V f=1MHz - 47 - fF CBS CB capacitance f transition frequency I =10mA V =2V -21 - GHz T C CE f= 2GHz T =25 C amb 2 G maximum power gain I =15mA V =2V - 24.5 - dB p(max) C CE f= 2.4GHz T =25 C amb NF noise figure I =3mA V =2V -0.85 - dB C CE f= 2.4GHz = S opt P output power at 1 dB I =30mA V =2.5 V -11.5 - dBm L(1dB) C CE gain compression Z =Z =50 S L f= 2.4GHz T =25 C amb 1 T is the temperature at the solder point of the emitter lead. sp 2 G is the maximum power gain, if K > 1. If K < 1 then G = Maximum Stable Gain (MSG). p(max) p(max) 2. Pinning information Table 2. Discrete pinning Pin Description Simplified outline Graphic symbol 1emitter 34 4 2base 3emitter 2 4 collector 1, 3 2 1 mbb159 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BFU630F - plastic surface-mounted flat pack package reverse SOT343F pinning 4 leads BFU630F All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved. Product data sheet Rev. 1 15 December 2010 2 of 12