NXP Semiconductors Document Number: MC09XS3400 Rev. 5.0, 8/2018 Technical Data Quad high-side switch (9.0 mOhm) 09XS3400 The 09XS3400 is one in a family of SMARTMOS devices designed for low- voltage automotive lighting applications. Its four low R MOSFETs (quad DS(on) 9.0 m) can control four separate 55 W bulbs, and/or Xenon modules, and/or HIGH-SIDE SWITCH LEDs. Programming, control and diagnostics are accomplished using a 16-bit SPI interface. Output slew rates are selectable to control electromagnetic emissions. Additionally, each output has its own parallel input or SPI control for pulse-width modulation (PWM) control if desired. The 09XS3400 allows the user to program via the SPI the fault current trip levels and duration of acceptable lamp inrush. FK SUFFIX (PB-FREE) The device has fail-safe mode to provide fail-safe functionality of the outputs in 98ARL10596D case of MCU damage. 24-PIN PQFN Features Applications Low-voltage automotive lighting Four protected 9.0 m high-side switches (at 25 C) Halogen bulbs Operating voltage range of 6.0 V to 20 V with sleep current < 5.0 A, Light-emitting diodes (LEDs) extended mode from 4.0 V to 28 V High beam 8.0 MHz 16-bit 3.3 V and 5.0 V SPI control and status reporting with daisy Low beam chain capability Flashers PWM module using external clock or calibratable internal oscillator with Low-voltage industrial lighting programmable outputs delay management Smart overcurrent shutdown compliant to huge inrush current, severe short-circuit, overtemperature protections with time limited autoretry, and fail-safe mode in case of MCU damage Output OFF or ON openload detection compliant to bulbs or LEDs and short-to-battery detection, analog current feedback with selectable ratio and board temperature feedback V V V V V DD DD PWR DD PWR 09XS3400 VDD VPWR HS0 WAKE I/O FSB LOAD SCLK SCLK CS CBS HS1 SI SO LOAD I/O RSTB SO SI MCU HS2 I/O IN0 LOAD I/O IN1 I/O IN2 I/O IN3 HS3 A/D CSNS LOAD FSI GND GND Figure 1. 09XS3400 simplified application diagram 2018 NXP B.V.Table of contents 1 Orderable parts 3 2 Internal block diagram . 4 3 Pin connections 5 3.1 Pinout diagram . 5 3.2 Pin definitions . 5 4 Electrical characteristics . 7 4.1 Maximum ratings . 7 4.2 Static electrical characteristics . 9 4.3 Dynamic electrical characteristics . 12 4.4 Timing diagrams 16 5 Functional description 19 5.1 Introduction 19 5.2 Functional pin description . 19 5.3 Functional internal block description . 21 6 Functional device operation 22 6.1 SPI protocol description . 22 6.2 Operational modes 22 6.3 Protection and diagnostic features 27 6.4 Logic commands and registers . 31 7 Typical applications 40 7.1 Introduction 40 8 Packaging . 41 8.1 Soldering information . 41 8.2 Marking information 41 8.3 Package dimensions . 41 9 Revision history . 50 09XS3400 NXP Semiconductors 2