X-On Electronics has gained recognition as a prominent supplier of MRF1K50H-TF3 Sub-GHz Development Tools across the USA, India, Europe, Australia, and various other global locations. MRF1K50H-TF3 Sub-GHz Development Tools are a product manufactured by NXP. We provide cost-effective solutions for Sub-GHz Development Tools, ensuring timely deliveries around the world.

MRF1K50H-TF3 NXP

MRF1K50H-TF3 electronic component of NXP
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Part No.MRF1K50H-TF3
Manufacturer: NXP
Category: Sub-GHz Development Tools
Description: Sub-GHz Development Tools MRF1K50H 81.36 MHz Reference Circuit
Datasheet: MRF1K50H-TF3 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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Manufacturer
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RoHS - XON
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Minimum Operating Temperature
Maximum Operating Temperature
Operating Frequency
Output Power
Package / Case
Series
Technology
Type
Brand
Forward Transconductance - Min
Gain
Mounting Style
Number Of Channels
Transistor Polarity
Id - Continuous Drain Current
Pd - Power Dissipation
Product Type
Factory Pack Quantity :
Subcategory
Vds - Drain-Source Breakdown Voltage
Vgs - Gate-Source Voltage
Vgs Th - Gate-Source Threshold Voltage
Cnhts
Hts Code
Mxhts
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We are delighted to provide the MRF1K50H-TF3 from our Sub-GHz Development Tools category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MRF1K50H-TF3 and other electronic components in the Sub-GHz Development Tools category and beyond.

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DocumentNumber:MRF1K50H NXPSemiconductors Rev.1.1,03/2017 TechnicalData RFPowerLDMOSTransistor HighRuggednessN--Channel MRF1K50H Enhancement--ModeLateralMOSFET Thishighruggednessdeviceisdesignedforuseinhigh VSWRindustrial, scientific and medical applications, as well as radio and VHF TV broadcast, 1.8500MHz,1500WCW,50V sub--GHzaerospaceandmobileradioapplications.Itsunmatchedinputand WIDEBAND outputdesignallowsforwidefrequencyrangeusefrom1.8to500MHz. RFPOWERLDMOSTRANSISTOR TypicalPerformance:V =50Vdc DD Frequency P G out ps D (MHz) SignalType (W) (dB) (%) 27 CW 1550CW 25.9 78.3 (1) 81.36 CW 1400CW 23.0 75.0 (2,3) 87.5108 CW 1475CW 23.3 83.4 (4) 230 Pulse 1500Peak 23.7 74.0 (100 sec,20%DutyCycle) NI--1230H--4S LoadMismatch/Ruggedness Frequency P Test in SignalType VSWR (MHz) (W) Voltage Result (4) 230 Pulse >65:1atall 13Peak 50 NoDevice GateA 3 1 DrainA (100sec,20% PhaseAngles (3dB Degradation DutyCycle) Overdrive) 1. Datafrom81.36MHznarrowbandreferencecircuit(page11). 2. Datafrom87.5108MHzbroadbandreferencecircuit(page5). 4 2 DrainB GateB 3. Thevaluesshownarethecenterbandperformancenumbersacrosstheindicated frequencyrange. 4. Datafrom230MHznarrowbandproductiontestfixture(page16). (TopView) Features Note: Thebacksideofthepackageisthe Highdrain--sourceavalancheenergyabsorptioncapability sourceterminalforthetransistor. Unmatchedinputandoutputallowingwidefrequencyrangeutilization Figure1.PinConnections Devicecanbeusedsingle--endedorinapush--pullconfiguration Characterizedfrom30to50Vforeaseofuse Suitableforlinearapplication IntegratedESDprotectionwithgreaternegativegate--sourcevoltagerange forimprovedClassCoperation Recommendeddriver:MRFE6VS25N(25W) Lowerthermalresistancepartavailable:MRF1K50N IncludedinNXPproductlongevityprogramwithassuredsupplyfora minimumof15yearsafterlaunch TypicalApplications Industrial,scientific,medical(ISM) Lasergeneration Plasmaetching Particleaccelerators MRIandothermedicalapplications Industrialheating,weldinganddryingsystems Broadcast Radiobroadcast VHFTVbroadcast Aerospace VHFomnidirectionalrange(VOR) HFandVHFcommunications Weatherradar Mobileradio VHFandUHFbasestations 20162017NXPB.V. MRF1K50H RFDeviceData NXPSemiconductors 1Table1.MaximumRatings Rating Symbol Value Unit Drain--SourceVoltage V 0.5,+135 Vdc DSS Gate--SourceVoltage V 6.0,+10 Vdc GS OperatingVoltage V 50 Vdc DD StorageTemperatureRange T 65to+150 C stg CaseOperatingTemperatureRange T 40to+150 C C (1,2) OperatingJunctionTemperatureRange T 40to+225 C J TotalDeviceDissipation T =25C P 1667 W C D Derateabove25C 8.33 W/C Table2.ThermalCharacteristics (2,3) Characteristic Symbol Value Unit ThermalResistance,JunctiontoCase R 0.10 C/W JC CW:CaseTemperature78C,1500WCW,50Vdc,I =200mA,88MHz DQ(A+B) ThermalImpedance,JunctiontoCase Z 0.028 C/W JC Pulse:CaseTemperature73C,1500WPeak,100 secPulseWidth,20%DutyCycle, I =100mA,230MHz DQ(A+B) Table3.ESDProtectionCharacteristics TestMethodology Class HumanBodyModel(perJESD22--A114) 2,passes2500V MachineModel(perEIA/JESD22--A115) B,passes250V ChargeDeviceModel(perJESD22--C101) IV,passes2000V Table4.ElectricalCharacteristics (T =25Cunlessotherwisenoted) A Characteristic Symbol Min Typ Max Unit (4) OffCharacteristics Gate--SourceLeakageCurrent I 1 Adc GSS (V =5Vdc,V =0Vdc) GS DS Drain--SourceBreakdownVoltage V 135 Vdc (BR)DSS (V =0Vdc,I =30 Adc) GS D ZeroGateVoltageDrainLeakageCurrent I 10 Adc DSS (V =50Vdc,V =0Vdc) DS GS ZeroGateVoltageDrainLeakageCurrent I 20 Adc DSS (V =100Vdc,V =0Vdc) DS GS OnCharacteristics (4) GateThresholdVoltage V 1.7 2.2 2.7 Vdc GS(th) (V =10Vdc,I =2130Adc) DS D GateQuiescentVoltage V 1.9 2.4 2.9 Vdc GS(Q) (V =50Vdc,I =100mAdc,MeasuredinFunctionalTest) DD D(A+B) (4) Drain--SourceOn--Voltage V 0.15 Vdc DS(on) (V =10Vdc,I =2.4Adc) GS D (4) ForwardTransconductance g 33.5 S fs (V =10Vdc,I =36Adc) DS D 1. ContinuoususeatmaximumtemperaturewillaffectMTTF. 2. MTTFcalculatoravailableat

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