NX18P3001UKZ NXP

NX18P3001 Bidirectional high-side power switch for charger and USB-OTG combined applications Rev. 1 24 September 2013 Product data sheet 1. General description The NX18P3001 is an advanced bidirectional power switch and ESD- protection device for combined USB-OTG and charger port applications. It includes undervoltage lockout, overvoltage lockout and overtemperature protection circuits designed to automatically isolate the power switch terminals when a fault condition occurs. The device features two power switch input/output terminals (VBUSI and VBUSO), an open-drain acknowledge output (ACK), an enable input which includes logic level translation (EN) and low capacitance Transient Voltage Suppression (TVS) type ESD clamps for USB data and ID pins. When EN is set HIGH the device enters a low-power mode, disabling all protection circuits. When used in combined charger and USB-OTG applications the 30 V tolerant VBUSI switch terminal is used as the supply and switch input when charging, for USB-OTG the VBUSO switch terminal is used as the supply and switch input. Designed for operation from 3.2 V to 17.5 V, it is used in battery charging and power domain isolation applications to reduce power dissipation and extend battery life. 2. Features and benefits 30 V tolerant VBUSI supply pin Wide supply voltage range from 3.2 V to 17.5 V Automatic switch operation for charging within the supply range I maximum 3 A continuous current SW Low ON resistance: 62 m (typical) at a supply voltage of 5.0 V 1.8 V control logic input to open the switch Soft start turn-on slew rate Protection circuitry Overtemperature protection Overvoltage lockout Undervoltage lockout ESD protection: HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2 kV CDM AEC standard Q100-01 (JESD22-C101E) IEC61000-4-2 contact discharge exceeds 8 kV for pins VBUSI, D , D+ and ID Specified from 40 C to +85 CNX18P3001 NXP Semiconductors Bidirectional power switch for charger and USB-OTG combinations 3. Applications Smart and feature phones Tablets, eBooks 4. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version NX18P3001UK 40 C to +85 C WLCSP12 wafer level chip-scale package, 12 bumps NX18P3001 body 1.36 1.66 0.51 mm (Backside Coating included) 5. Marking Table 2. Marking codes Type number Marking code NX18P3001UK X18P3 6. Functional diagram (1 9%86,9% , & . DDD Fig 1. Logic symbol 9%86, 9%862 29/2 89/2 89/2 (1 &21752/ , &. 273 DDD Fig 2. Logic diagram (simplified schematic) NX18P3001 All information provided in this document is subject to legal disclaimers. NXP B.V. 2013. All rights reserved. Product data sheet Rev. 1 24 September 2013 2 of 21 862