X-On Electronics has gained recognition as a prominent supplier of FDB039N06 MOSFETs across the USA, India, Europe, Australia, and various other global locations. FDB039N06 MOSFETs are a product manufactured by ON Semiconductor. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

FDB039N06 ON Semiconductor

FDB039N06 electronic component of ON Semiconductor
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Part No.FDB039N06
Manufacturer: ON Semiconductor
Category: MOSFETs
Description: Trans MOSFET N-CH 60V 174A 3-Pin(2+Tab) D2PAK Tube
Datasheet: FDB039N06 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
7: USD 1.1313 ea
Line Total: USD 7.92 
Availability - 0
MOQ: 7  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Fri. 22 Nov to Thu. 28 Nov
MOQ : 188
Multiples : 188
188 : USD 1.9154

0
Ship by Fri. 22 Nov to Thu. 28 Nov
MOQ : 7
Multiples : 1
7 : USD 1.1313

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Packaging
Number of Channels
Configuration
Series
Transistor Type
Brand
Forward Transconductance - Min
Fall Time
Rise Time
Factory Pack Quantity :
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the FDB039N06 from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the FDB039N06 and other electronic components in the MOSFETs category and beyond.

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FDB039N06 N-Channel PowerTrench MOSFET March 2013 FDB039N06 N-Channel PowerTrench MOSFET 60 V, 174 A, 3.9 m Features General Description R = 2.95 m ( Typ.) V = 10 V, I = 75 A This N-Channel MOSFET is produced using Fairchild DS(on) GS D Semiconductor s advanced PowerTrench process that has Fast Switching Speed been tailored to minimize the on-state resistance while maintain- ing superior switching performance. Low Gate Charge High Performance Trench Technology for Extremely Low Applications R DS(on) Synchronous Rectification for ATX / Server / Telecom PSU High Power and Current Handling Capability Battery Protection Circuit RoHS Compliant Motor drives and Uninterruptible Power Supplies Renewable system D D G 2 D -PAK G S S o MOSFET Maximum Ratings T = 25 C unless otherwise noted C Symbol Parameter FDB039N06 Unit V Drain to Source Voltage 60 V DSS V Gate to Source Voltage 20 V GSS o -Continuous (T = 25 C, Silicion Limited) 174* C o I Drain Current -Continuous (T = 100 C, Silicion Limited) 123* A D C o -Continuous (T = 25 C, Package Limited) 120 C I Drain Current - Pulsed (Note 1) 696 A DM E Single Pulsed Avalanche Energy (Note 2) 872 mJ AS dv/dt Peak Diode Recovery dv/dt (Note 3) 7.0 V/ns o (T = 25 C) 231 W C P Power Dissipation D o o - Derate above 25C1.54W/ C o T , T Operating and Storage Temperature Range -55 to +175 C J STG Maximum Lead Temperature for Soldering Purpose, o T 300 C L 1/8 from Case for 5 Seconds *Calculated continuous current based on maximum allowable junction temperature. Package limitation current is 120A. Thermal Characteristics Symbol Parameter FDB039N06 Unit R Thermal Resistance, Junction to Case, Max. 0.65 JC o Thermal Resistance, Junction to Ambient (minimum pad of 2 oz copper), Max. 62.5 C/W R JA 2 Thermal Resistance, Junction to Ambient (1 in pad of 2 oz copper), Max. 40 2009 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FDB039N06 Rev. C1 FDB039N06 N-Channel PowerTrench MOSFET Package Marking and Ordering Information Device Marking Device Package Reel Size Tape Width Quantity FDB039N06 FDB039N06 TO-263 Tube - 50 o Electrical Characteristics T = 25 C unless otherwise noted C Symbol Parameter Test Conditions Min. Typ. Max. Unit Off Characteristics o BV Drain to Source Breakdown Voltage I = 250A, V = 0V, T = 25C60 - - V DSS D GS C BV Breakdown Voltage Temperature DSS o o I = 250A, Referenced to 25 C - 0.04 - V/ C D T Coefficient J V = 60V, V = 0V - - 1 DS GS I Zero Gate Voltage Drain Current A DSS o V = 60V, V = 0V, T = 150 C - - 500 DS GS C I Gate to Body Leakage Current V = 20V, V = 0V - - 100 nA GSS GS DS On Characteristics V Gate Threshold Voltage V = V , I = 250A2.53.54.5V GS(th) GS DS D R Static Drain to Source On Resistance V = 10V, I = 75A - 2.95 3.9 m DS(on) GS D g Forward Transconductance V = 10V, I = 75A - 169 - S FS DS D Dynamic Characteristics C Input Capacitance - 6190 8235 pF iss V = 25V, V = 0V DS GS C Output Capacitance - 900 1195 pF oss f = 1MHz C Reverse Transfer Capacitance - 385 580 pF rss Q Total Gate Charge at 10V - 102 133 nC g(tot) V = 48V, I = 75A DS D Q Gate to Source Gate Charge V = 10V - 32 - nC gs GS (Note 4) Q Gate to Drain Miller Charge - 32 - nC gd Switching Characteristics t Turn-On Delay Time -30 70 ns d(on) V = 30V, I = 75A t Turn-On Rise Time - 40 90 ns DD D r V = 10V, R = 4.7 GS GEN t Turn-Off Delay Time - 55 120 ns d(off) t Turn-Off Fall Time (Note 4) - 24 58 ns f Drain-Source Diode Characteristics I Maximum Continuous Drain to Source Diode Forward Current - - 174 A S I Maximum Pulsed Drain to Source Diode Forward Current - - 696 A SM V Drain to Source Diode Forward Voltage V = 0V, I = 75A - - 1.3 V SD GS SD t Reverse Recovery Time -41 - ns V = 0V, I = 75A rr GS SD dI /dt = 100A/s Q Reverse Recovery Charge - 47 - nC F rr Notes: 1: Repetitive Rating: Pulse width limited by maximum junction temperature 2: L = 0.31mH, I = 75A, V = 50V, R = 25, Starting T = 25C AS DD G J 3: I 75A, di/dt 200A/s, V BV , Starting T = 25 SD DD DSS J 4: Essentially Independent of Operating Temperature Typical Characteristics 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com 2 FDB039N06 Rev. C1

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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