ON Semiconductor Is Now To learn more about onsemi, please visit our website at www.onsemi.com onsemi andand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba onsemi or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided as-is and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. Typical parameters which may be provided in onsemi data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and holdo nsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. FGA15N120ANTDTU 1200 V, 15 A NPT Trench IGBT FGA15N120ANTDTU 1200 V, 15 A NPT Trench IGBT Description Using ON Semiconductor s proprietary trench design and Features advanced NPT technology, the 1200V NPT IGBT offers NPT Trench Technology, Positive temperature coefficient superior conduction and switching performances, high avalanche ruggedness and easy parallel operation. Low Saturation Voltage: V = 1.9 V CE(sat), typ I = 15 A and T = 25 C This device is well suited for the resonant or soft switching appli- C C cation such as induction heating, microwave oven. Low Switching Loss: E = 0.6 mJ off, typ I = 15 A and T = 25 C C C Extremely Enhanced Avalanche Capability CC GG TO-3P EE G C E Absolute Maximum Ratings Symbol Description Ratings Unit V Collector-Emitter Voltage 1200 V CES V Gate-Emitter Voltage 20 V GES I Collector Current T = 25 C30 A C C Collector Current T = 100 C15 A C I Pulsed Collector Current (Note 1) 45 A CM Diode Continuous Forward Current T = 25 C30 A C I F Diode Continuous Forward Current T = 100 C15 A C I Diode Maximum Forward Current 45 A FM Maximum Power Dissipation T = 25 C 186 W C P D Maximum Power Dissipation T = 100 C74 W C T Operating Junction Temperature -55 to +150 C J T Storage Temperature Range -55 to +150 C stg T Maximum Lead Temp. for soldering 300 C L Purposes, 1/8 from case for 5 seconds Thermal Characteristics Symbol Parameter Typ. Max. Unit R Thermal Resistance, Junction-to-Case for IGBT -- 0.67 C/W JC R Thermal Resistance, Junction-to-Case for Diode -- 2.88 C/W JC R Thermal Resistance, Junction-to-Ambient -- 40 C/W JA Notes: (1) Repetitive rating: Pulse width limited by max. junction temperature Publication Order Number: 2006 Semiconductor Components Industries, LLC. FGA15N120ANTDTU/D October-2017,Rev.3