NTD20N06, NTDV20N06 MOSFET Power, N-Channel, DPAK 20 A, 60 V Designed for low voltage, high speed switching applications in power supplies, converters and power motor controls and bridge circuits. Features www.onsemi.com Lower R DS(on) Lower V DS(on) V R TYP I MAX (BR)DSS DS(on) D Lower Capacitances 60 V 20 A 37.5 m Lower Total Gate Charge Lower and Tighter V SD NChannel Lower Diode Reverse Recovery Time D Lower Reverse Recovery Stored Charge NTDV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements AECQ101 Qualified and PPAP Capable G These Devices are PbFree and are RoHS Compliant Typical Applications S Power Supplies 4 Converters Power Motor Controls 2 1 Bridge Circuits 3 MAXIMUM RATINGS (T = 25C unless otherwise noted) DPAK J CASE 369C Rating Symbol Value Unit STYLE 2 DraintoSource Voltage V 60 Vdc DSS DraintoGate Voltage (R = 10 M ) V 60 Vdc GS DGR MARKING DIAGRAM GatetoSource Voltage Vdc & PIN ASSIGNMENTS Continuous V 20 GS 4 Nonrepetitive (t 10 ms) V 30 p GS Drain Drain Current Adc Continuous T = 25C I 20 A D Continuous T = 100C I 10 A D Single Pulse (t 10 s) I 60 Apk p DM Total Power Dissipation T = 25C P 60 W A D Derate above 25C 0.40 W/C 2 Total Power Dissipation T = 25C (Note 1) 1.88 W A 1 3 Drain Total Power Dissipation T = 25C (Note 2) 1.36 W A Gate Source Operating and Storage Temperature Range T , T 55 to C J stg 175 A = Assembly Location* 20N06 = Device Code Single Pulse DraintoSource Avalanche E 170 mJ AS Y = Year Energy Starting T = 25C J WW = Work Week (V = 25 Vdc, V = 10 Vdc, DD GS G = PbFree Package L = 1.0 mH, I (pk) = 18.4 A, V = 60 Vdc) L DS Thermal Resistance C/W * The Assembly Location code (A) is front side JunctiontoCase R 2.5 JC optional. In cases where the Assembly Location is JunctiontoAmbient (Note 1) R 80 JA stamped in the package, the front side assembly JunctiontoAmbient (Note 2) R 110 JA code may be blank. Maximum Lead Temperature for Soldering T 260 C L Purposes, 1/8 from case for 10 seconds ORDERING INFORMATION Stresses exceeding those listed in the Maximum Ratings table may damage the See detailed ordering and shipping information on page 3 of device. If any of these limits are exceeded, device functionality should not be this data sheet. assumed, damage may occur and reliability may be affected. Semiconductor Components Industries, LLC, 2014 1 Publication Order Number: May, 2019 Rev. 10 NTD20N06/D AYWW 20 N06GNTD20N06, NTDV20N06 1. When surface mounted to an FR4 board using the minimum recommended pad size. 2. When surface mounted to an FR4 board using the 0.5 sq in drain pad size. www.onsemi.com 2