NVMFS6B25NL Power MOSFET 100 V, 24 m , 33 A, Single NChannel Features Small Footprint (5x6 mm) for Compact Design Low R to Minimize Conduction Losses DS(on) Low Q and Capacitance to Minimize Driver Losses www.onsemi.com G NVMFS6B25NLWF Wettable Flank Option for Enhanced Optical Inspection V R MAX I MAX (BR)DSS DS(ON) D AECQ101 Qualified and PPAP Capable 24 m 10 V These Devices are PbFree and are RoHS Compliant 100 V 33 A 39 m 4.5 V MAXIMUM RATINGS (T = 25C unless otherwise noted) J Parameter Symbol Value Unit D (5,6) DraintoSource Voltage V 100 V DSS GatetoSource Voltage V 16 V GS Continuous Drain Cur- T = 25C I 33 A C D rent R (Notes 1, 2, JC G (4) T = 100C 23 3) C Steady State Power Dissipation T = 25C P 62 W C D R (Notes 1, 2) JC S (1,2,3) T = 100C 31 C NCHANNEL MOSFET Continuous Drain Cur- T = 25C I 8 A A D rent R (Notes 1, 2, JA T = 100C 6 3) A Steady MARKING State Power Dissipation T = 25C P 3.6 W A D DIAGRAM R (Notes 1 & 2) JA T = 100C 1.8 A D 1 Pulsed Drain Current T = 25C, t = 10 s I 177 A A p DM S D 6B25xx DFN5 S Operating Junction and Storage Temperature T , T 55 to C J stg AYWZZ (SO8FL) S + 175 CASE 488AA G D Source Current (Body Diode) I 48 A S STYLE 1 D Single Pulse DraintoSource Avalanche E 170 mJ AS 6B25NL = NVMFS6B25NL Energy (I = 2.0 A) L(pk) 6B25LW = NVMFS6B25NLWF Lead Temperature for Soldering Purposes T 260 C L A = Assembly Location (1/8 from case for 10 s) Y = Year W = Work Week Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be ZZ = Lot Traceability assumed, damage may occur and reliability may be affected. THERMAL RESISTANCE MAXIMUM RATINGS ORDERING INFORMATION Parameter Symbol Value Unit See detailed ordering, marking and shipping information on page 5 of this data sheet. JunctiontoCase Steady State R 2.4 C/W JC JunctiontoAmbient Steady State (Note 2) 42 R JA 1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 2 2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad. 3. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle. Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: July, 2017 Rev. 1 NVMFS6B25NL/DNVMFS6B25NL ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 100 V (BR)DSS GS D DraintoSource Breakdown Voltage V / 64 (BR)DSS mV/C Temperature Coefficient T J Zero Gate Voltage Drain Current I V = 0 V, T = 25C 10 DSS GS J V = 80 V A DS T = 125C 250 J GatetoSource Leakage Current I V = 0 V, V = 16 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 4) Gate Threshold Voltage V V = V , I = 250 A 1.0 3.0 V GS(TH) GS DS D Threshold Temperature Coefficient V /T 5.4 mV/C GS(TH) J V = 10 V 19.8 24 GS DraintoSource On Resistance R I = 20 A m DS(on) D V = 4.5 V 31 39 GS CHARGES, CAPACITANCES & GATE RESISTANCE Input Capacitance C 905 ISS Output Capacitance C 302 V = 0 V, f = 1 MHz, V = 25 V pF OSS GS DS Reverse Transfer Capacitance C 23 RSS V = 4.5 V, V = 50 V I = 25 A 6.4 GS DS D Total Gate Charge Q G(TOT) 13.5 Threshold Gate Charge Q 1.8 nC G(TH) GatetoSource Charge Q 3.6 V = 10 V, V = 50 V I = 25 A GS GS DS D GatetoDrain Charge Q 1.8 GD Plateau Voltage V 3.7 V GP SWITCHING CHARACTERISTICS (Note 5) TurnOn Delay Time t 9.6 d(ON) Rise Time t 79 r V = 4.5 V, V = 50 V, GS DS ns I = 25 A, R = 1.0 D G TurnOff Delay Time t 18.3 d(OFF) Fall Time t 73 f DRAINSOURCE DIODE CHARACTERISTICS Forward Diode Voltage V T = 25C 0.91 1.2 SD J V = 0 V, GS V I = 25 A S T = 125C 0.81 J Reverse Recovery Time t 40.4 RR Charge Time t 24.5 ns a V = 0 V, dIS/dt = 100 A/ s, GS I = 20 A Discharge Time t S 15.9 b Reverse Recovery Charge Q 50 nC RR Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Pulse Test: pulse width 300 s, duty cycle 2%. 5. Switching characteristics are independent of operating junction temperatures. www.onsemi.com 2