PCS3P7303A General Purpose Peak EMI Reduction IC Functional Description PCS3P7303A is a versatile, 3.3 V / 2.5 V Peak EMI reduction IC www.onsemi.com based on TIMING SAFE technology. PCS3P7303A accepts an input clock either from a Crystal or from an external reference (AC or MARKING DC coupled to XIN / CLKIN) and locks on to it delivering a 1x DIAGRAMS modulated clock output. PCS3P7303A has a Frequency Selection (FS) control that facilitates selecting one of the two frequency ranges BKL YWW within the operating frequency range. Refer to the Frequency A Selection Table for details. PCS3P7303A has an SSEXTR pin to select different deviations TSSOP8 4.4x3 depending upon the value of an external resistor connected between CASE 948AL SSEXTR and GND. Modulation Rate (MR) control selects two different Modulation Rates. 1 PPCS3P7303A operates from a 3.3 V / 2.5 V supply and is available BK M in an 8pin TSSOP and 8L 2 mm x 2 mm WDFN packages. 1 WDFN8 2x2, 0.5P Application CASE 511AQ PCS3P7303A is targeted for many applications including USB and SATA. XX = Specific Device Code M = Date Code General Features YY, Y = Year WW, W = Work Week 1x LVCMOS Peak EMI Reduction A = Assembly Location Input Frequency: = PbFree Device 10 MHz 70 MHz 2.5 V (Note: Microdot may be in either location) 10 MHz 80 MHz 3.3 V Output Frequency: PIN CONFIGURATION 10 MHz 70 MHz 2.5 V 10 MHz 80 MHz 3.3 V XIN / CLKIN 1 8 VDD Analog Deviation Selection ModRate Selection Option XOUT 2 7 SSEXTR Supply Voltage: 2.5 V 0.2 V PCS3P7303A 3.3 V 0.3 V 3 6 FS MR 8pin TSSOP, 8L 2 mm x 2 mm WDFN (TDFN) Packages 4 5 The First True Dropin Solution GND ModOUT These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant ORDERING INFORMATION See detailed ordering and shipping information on page 7 of this data sheet. Semiconductor Components Industries, LLC, 2014 1 Publication Order Number: October, 2014 Rev. 0 PCS3P7303A/DPCS3P7303A VDD FS MR XIN / CLKIN ModOUT Crystal PLL XOUT Oscillator GND SSEXTR Figure 1. Block Diagram Table 1. PIN DESCRIPTION Pin Pin Name Type Description 1 XIN / CLKIN Input Crystal connection or External reference clock input. 2 XOUT Output Crystal connection. If using an external reference, this pin should be left open. 3 FS Input Frequency Select. Pull LOW to select Low Frequency range. Selects High Frequency range when pulled HIGH. Has an internal pull up resistor. (See Frequency Selection table for details.) 4 GND Power Ground. 5 ModOUT Output Buffered Modulated clock output. 6 MR input Modulation Rate Select. When LOW selects Low Modulation Rate. Selects High Modulation Rate when pulled HIGH. Has an internal pull down resistor. 7 SSEXTR Input Analog Deviation Selection through external resistor to GND. 8 VDD Power 2.5 V / 3.3 V supply Voltage. Table 2. FREQUENCY SELECTION TABLE VDD (V) FS Frequency (MHz) 0 10 35 2.5 1 30 70 0 10 40 3.3 1 30 80 Table 3. ABSOLUTE MAXIMUM RATINGS Symbol Parameter Rating Unit VDD, V Voltage on any input pin with respect to Ground 0.5 to +4.6 V IN T Storage temperature 65 to +125 C STG T Max. Soldering Temperature (10 sec) 260 C s T Junction Temperature 150 C J T Static Discharge Voltage (As per JEDEC STD22 A114B) 2 kV DV Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. www.onsemi.com 2