TGC1430F Qorvo

Fund. Isolation (dB) Product Data Sheet August 5, 2008 20 - 40 GHz X2 Frequency Multiplier TGC1430F Key Features and Performance 0.25um pHEMT Technology 20 - 40 GHz Output Frequencies 10 - 20 GHz Fundamental Frequencies -12 +/- 2dB Conversion Gain 18 dBm Input Drive Optimum 25dB Fundamental Isolation Primary Applications Point-to-Point Radio Chip Dimensions 1.50 mm x 1.50 mm Point-to-Multipoint Communications 0.0 0 35 -5.0 -5 30 -10.0 -10 25 -15.0 -15 20 -20.0 17.5dBm -25.0 -20 15 Input Drive of +17.5dBm -30.0 -25 10 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 22.0 13.5 14.0 14.5 15.0 15.5 16.0 Input Frequency (GHz) Input Frequency (GHz) Conversion Gain vs Input Frequency (Input 17.5dBm) Conversion Gain and Fundamental Isolation for 27 - 32 GHz Output 45 40 35 30 25 20 15 10 5 0 6 8 10 12 14 16 18 20 22 17.5dBm Input Frequency (GHz) Fundamental Isolation Note: Datasheet is subject to change without notice. 1 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw tqs.com Web: www.triquint.com Conversion Gain (dB) Fundamental Isolation (dB) Conversion Gain (dB) Product Data Sheet August 5, 2008 TGC1430F Mechanical Drawing 1.49 0.059 2 1.12 0.044 .84 0.033 1 .00 0.000 Units: millimeters inches Thickness: 0.10 0.004 (reference only) Chip edge to bond pad dimensions are shown to center of bond pads. Chip size tolerance: 0.05 0.002 RF ground through backside Bond Pad 1 RF Input 0.10 x 0.20 0.004 x 0.008 Bond Pad 2 RF Output 0.10 x 0.20 0.004 x 0.008 GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. 2 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw tqs.com Web: www.triquint.com .00 0.000 .09 0.004 1.40 0.055 1.49 0.059