CRS05 TOSHIBA Schottky Barrier Diode CRS05 Secondary Rectification in Switching Regulators Unit: mm Reverse-Current Protection in Mobile Devices Repetitive peak reverse voltage : V = 30 V RRM Average forward current : I = 1.0 A F (AV) Peak forward voltage : V = 0.45 V (max) I = 1.0 A FM FM Repetitive peak reverse current : I = 5 A (max) V = 5 V RRM RRM The use of small, thin surface-mount package is optimum way for high-density mounting. TM Nickname: S-FLAT Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Repetitive peak reverse voltage V 30 V RRM 1.0 (Note 1) Average forward current I A F(AV) 1 ANODE 1.0 (Note 2) 2 CATHODE Non-repetitive peak forward surge current I 20 (50 Hz) A FSM Junction temperature T 40 to 150 C j Storage temperature T 40 to 150 C stg Note 1: Ta = 102C Device mounted on a ceramic board JEDEC board size 50 mm 50 mm Soldering land size 2 mm 2 mm JEITA board thickness 0.64 mm TOSHIBA 3-2A1S Rectangular waveform = 180, VR = 15 V Note 2: Ta = 54.7C Device mounted on a glass-epoxy board Weight: 0.013 g (typ.) board size 50 mm 50 mm Soldering land size 6 mm 6 mm board thickness 1.6 mm Rectangular waveform = 180, VR = 15 V Note : Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical Characteristics (Ta = 25C) Characteristics Symbol Test Condition Min Typ. Max Unit V I = 0.1 A (pulse test) 0.33 FM (1) FM Peak forward voltage V I = 0.7 A (pulse test) 0.40 V FM (2) FM V I = 1.0 A (pulse test) 0.42 0.45 FM (3) FM I V = 5 V (pulse test) 2.0 5.0 RRM (1) RRM Repetitive peak reverse current A I V = 30 V (pulse test) 20 200 RRM (2) RRM Junction capacitance C V = 10 V, f = 1.0 MHz 60 pF j R Device mounted on a ceramic board board size 50 mm 50 mm 70 soldering land size 2 mm 2 mm board thickness 0.64 mm Thermal resistance R C/W th (j-a) (junction to ambient) Device mounted on a glass-epoxy board board size 50 mm 50 mm 140 soldering land size 6 mm 6 mm board thickness 1.6 mm Start of commercial production 2000-07 1 2019-04-01 CRS05 Marking Abbreviation Code Part No. S5 CRS05 Land pattern dimensions for reference only Unit: mm 1.2 1.2 2.8 Usage Considerations 1) Schottky barrier diodes have reverse current characteristics compared to other diodes. There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage. Please take forward and reverse loss into consideration during design. 2) The absolute maximum ratings are rated values that must not be exceeded for a moment to have you use an element safely. Please refer to each following absolute maximum ratings on the occasion of use and design. V : V has a temperature coefficient of 0.1 %/C. RRM RRM Please take this coefficient into account when designing a circuit board that will be operated in a low-temperature environment. I : We recommend that the current be in less than 80 % of rating and the junction temperature (T ) F(AV) j be in less than 80 % of absolute maximum rating under the worst condition. This rating is based on the premise that the device is radiating heat enough. Therefore, when enough heat radiation is not expected, please consider the margin to the permission curve of T - I for using the device. a(max) F(AV) I : This rating specifies a non-repetitive limit value. FSM This only applies to an abnormal operation, which seldom occurs during the lifespan of a device. T : Derate device parameters in proportion to this rating in order to ensure high reliability. j We recommend that the junction temperature (T ) of a device be kept below 80 %. j 3) Thermal resistance (junction-to-ambient) varies with the mounting conditions of the device on the circuit board. An appropriate thermal resistance value that should be used, must be considering the circuit board design and soldering land size. 4) For other design considerations, see the Toshiba website. 2 2019-04-01