TCK128BG TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic TCK128BG 0.08 nA Ultra small IQ 1.0 A Load Switch IC in Ultra Small Package TCK128BG is load switch IC for a general power management with slew rate control driver, featuring super low quiescent current, low switch ON resistance and wide input operation voltage range from 1.0 to 5.5 V. Quiescent current is only 0.08 nA and output current is available up to 1.0 A. TCK128BG also feature output auto-discharge function. This device is available in 0.35 mm pitch ultra small package WCSP4G (0.645 mm x 0.645 mm, t: 0.465 mm max.) with back side coating that protect from external damage. WCSP4G Thus this device is ideal for portable applications that require high-density board assembly and ultra low power consumption such as wearables, Weight: 0.38 mg (typ.) smartphones, and IoT modules. Feature Wide input operation voltage range : V = 1.0 to 5.5 V IN High output current : I = 1.0 A OUT Ultra small Quiescent current : I = 0.08 nA at V = 5.5 V, V = 0 V, I =0 mA Q IN CT OUT Low ON resistance R = 58 m (typ.) at V = 3.3 V, I = -0.5 A ON IN OUT R = 106 m (typ.) at V = 1.8 V, I = -0.5 A ON IN OUT Built in Slew rate control driver Built in Auto-discharge Active Low Ultra small package : WCSP4G with back side coating (0.645 mm x 0.645 mm, t: 0.465 mm max.) Pin Assignment(Top view) Top marking V CONTROL IN (A2) (B2) 8: TCK128BG Index GND VOUT (B1) (A1) Start of commercial production 2021-11 2021 1 2021-10-28 Toshiba Electronic Devices & Storage Corporation TCK128BG Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Input voltage V -0.3 to 6.0 V IN Control voltage V -0.3 to 6.0 V CT Output voltage V -0.3 to V +0.3 V OUT IN DC 1.0 A Output current I OUT Pulse 2.0 (Note 1) A Power dissipation P 1.0 (Note 2) W D Junction temeperature Tj 150 C Storage temperature T 55 to 150 C stg Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note1: 300 s pulse, 2% duty cycle Note2: Rating at mounting on a board Glass epoxy board dimension : 40 mm x 40 mm , 4 layer Metal pattern ratio : approximately 70% each layer Block Diagram V V OUT IN Slew Rate Control Driver Control Logic CONTROL Control signal Output High : OFF Discharge Low : ON GND Operating conditions Characteristics Symbol Condition Min Max Unit Input voltage V 1.0 5.5 V IN Output current I 1.0 A OUT CONTROL High-level input voltage V 0.9 V IH 1.0 V V 5.5 V IN CONTROL Low-level input voltage V 0.4 V IL Operating Ambient temperature range T -40 85 C a opr 2021 2 2021-10-28 Toshiba Electronic Devices & Storage Corporation