TCK207AN TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic TCK207AN 0.75 V, 2A Load Switch IC with Reverse Current Blocking in Ultra Small Package TCK207AN is 0.75 V ultra-low voltage load switch IC for a power management with slew rate control driver and reverse current blocking (SW OFF state) function. Switch ON resistance is only 21.5 m (typ.) at 0.75 V, -1.5 A condition and output current is available up to 2.0 A (DC). TCK207AN features output auto- discharge function. This device is available in ultra-small package DFN4A (1.2 mm x 1.2 mm, t: 0.38 mm) .Thus this device is ideal for portable applications that require high- density board assembly such as SSD, HDD, cellular phone. DFN4A Features Weight : 1.4 mg (Typ.) Low input voltage operation: V = 0.75 to 3.6 V IN High output current: I (DC) = 2.0 A OUT Low ON resistance : R = 21.5 m (typ.) at V = 3.3 V, -1.5 A ON IN R = 21.5 m (typ.) at V = 1.2 V, -1.5 A ON IN R = 21.5 m (typ.) at V = 0.75 V, -1.5 A ON IN Built in Slew rate control driver Built in Reverse current blocking(SW OFF state) Built in Auto-discharge Active High and Pull down connection between CONTROL and GND Ultra-small package : DFN4A (1.2 mm x 1.2 mm, t: 0.38 mm) Pin Assignment (Top view) Marking INDEX INDEX 1: VOUT 4: VIN 2: GND 3: CONTROL Part No. (abbreviation code) Lot No. Start of commercial production 2020-03 2019 2019-12-13 1 Toshiba Electronic Devices & Storage Corporation TCK207AN Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Input voltage V -0.3 to 4.0 V IN Control voltage V -0.3 to 4.0 V CT Output voltage V -0.3 to V +0.3 V OUT IN DC 2.0 A Output current I OUT Pulse 3.0 (Note 1) A Power dissipation P 1 (Note 2) W D Operating temperature range T 40 to 85 C opr Junction temeperature Tj 150 C Storage temperature T 55 to 150 C stg Note : Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc.). Note1: 100 s pulse, 2% duty cycle Note2: Rating at mounting on a board (Glass epoxy(FR4) board dimension : 40mm x 40mm (double sided board), t=1.6mm Metal pattern ratio : a surface approximately 70%, the reverse side approximately 70% Through hole : diameter 0.5mm x 24) 2019 2019-12-13 2 Toshiba Electronic Devices & Storage Corporation