TLP2270(TP4,E Toshiba

TLP2270 Photocouplers Infrared LED & Photo IC TLP2270TLP2270TLP2270TLP2270 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Factory Networking High-Speed Digital Interfacing for Instrumentation and Control Devices I/O Interface Boards 2. 2. 2. 2. GeneralGeneralGeneralGeneral The Toshiba TLP2270 consists of a high-output infrared LED coupled with a high-speed photo-diode-transistor chip. It is housed in the SO8L package. It is housed in a thin SO8L package of 2.35 mm (max). The TLP2270 guarantees isolation voltage 5000 Vrms and compliant with international safety standards for reinforced insulation. It has two circuits built into a single SO8L package, which can reduce the mounting area. This photocoupler guarantees operation at up to 125 and on supplies from 2.7 V to 5.5 V. Since TLP2270 guarantees 0.8 mA low supply current (I /I ), and 1 mA (T = 125 ) low threshold input current (I ), DDL DDH a FLH it contributes to energy saving of devices. It can be driven directly from a microcomputer by a low input current. The TLP2270 has an internal Faraday shield that provides a guaranteed common-mode transient immunity of 20 kV/s. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Buffer logic type (totem pole output) (2) Package: SO8L (3) Operating temperature: -40 to 125 (4) Supply voltage: 2.7 to 5.5 V (5) Data transfer rate: 20 MBd (typ.) (NRZ) (6) Threshold input current: 1 mA (max) (7) Supply current: 0.8 mA (max) (8) Common-mode transient immunity: 20 kV/s (min) (9) Isolation voltage: 5000 Vrms (min) (10) Safety standards UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1)(Note 1)(Note 1) CQC-approved: GB4943.1, GB8898 Japan Factory Option (D4) Note 1: When a VDE approved type is needed, please designate the Option (D4)Option (D4)Option (D4). Start of commercial production 2016-10 2016-2019 2019-11-26 1 Toshiba Electronic Devices & Storage Corporation Rev.5.0TLP2270 4. 4. 4. 4. Packaging and Pin AssignmentPackaging and Pin AssignmentPackaging and Pin AssignmentPackaging and Pin Assignment 1: Anode 1 2: Cathode 1 3: Cathode 2 4: Anode 2 5: GND 6: V 2 (output 2) O 7: V 1 (output 1) O 8: V DD 11-6B1A 5. 5. 5. 5. Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note) Note: A 0.1-F bypass capacitor must be connected between pin 8 and pin 5. 6. 6. 6. 6. Principle of OperationPrinciple of OperationPrinciple of OperationPrinciple of Operation 6.1. 6.1. 6.1. 6.1. Truth TableTruth TableTruth TableTruth Table Input LED1 (2) M1 (3) M2 (4) Output 1 (2) H ON ON OFF H L OFF OFF ON L 6.2. 6.2. 6.2. 6.2. Mechanical ParametersMechanical ParametersMechanical ParametersMechanical Parameters Characteristics Min Unit Creepage distances 8.0 mm Clearance 8.0 Internal isolation thickness 0.4 2016-2019 2019-11-26 2 Toshiba Electronic Devices & Storage Corporation Rev.5.0