TLP2312(TPL,E Toshiba

TLP2312 Photocouplers Infrared LED & Photo IC TLP2312TLP2312TLP2312TLP2312 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Programmable Logic Controllers (PLCs) Industrial Inverters High-Speed Digital Interfacing for Instrumentation and Control Devices 2. 2. 2. 2. GeneralGeneralGeneralGeneral TLP2312 is 5 Mbps high speed photocoupler operated at low supply voltage in the small SO6 package. Since supply voltage of only 2.2 V is needed to operate TLP2312, building another power supply circuit is unnecessary even in using it in a low supply voltage system of 2.5 V LVCMOS level. Therefore, this product contributes to reduce the number of components. The low threshold input current (I ) of 1.6 mA (max) and the low supply current (I /I ) of 0.5 mA (max) FLH DDL DDH at entire operating temperature range of -40 to 125 enables TLP2312 to be driven from a microcontroller directly, and provides energy saving of systems. The detector has a totem-pole output stage with current sourcing and sinking capabilities. TLP2312 has an internal Faraday shield that provides a guaranteed common-mode transient immunity of 20 kV/s. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Package: SO6 (2) Data transfer rate: 5 Mbps (typ.) (3) Supply current: 0.5 mA (max) (4) Threshold input current: 1.6 mA (max) (5) Supply voltage: 2.2 to 5.5 V (6) Operating temperature range: -40 to 125 (7) Pulse width distortion: 20 ns (max) (8) Isolation voltage: 3750 Vrms (min) (9) Safety standards UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1)(Note 1)(Note 1) CQC-approved: GB4943.1, GB8898 Japan Factory (Pending) Note 1: When a VDE approved type is needed, please designate the Option (V4)Option (V4)Option (V4)Option (V4). Start of commercial production 2020-02 2020 2020-03-31 1 Toshiba Electronic Devices & Storage Corporation Rev.2.0TLP2312 4. 4. 4. 4. Packaging and Pin AssignmentPackaging and Pin AssignmentPackaging and Pin AssignmentPackaging and Pin Assignment 1: Anode 3: Cathode 4: GND 5: V (Output) O 6: V DD 11-4L1S 5. 5. 5. 5. Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note) Note: A 0.1-F bypass capacitor must be connected between pin 6 and pin 4. 6. 6. 6. 6. Principle of OperationPrinciple of OperationPrinciple of OperationPrinciple of Operation 6.1. 6.1. 6.1. 6.1. Truth TableTruth TableTruth TableTruth Table Input LED Output H ON H L OFF L 6.2. 6.2. 6.2. 6.2. Mechanical ParametersMechanical ParametersMechanical ParametersMechanical Parameters Characteristics Min Unit Creepage distances 5.0 mm Clearance 5.0 Internal isolation thickness 0.4 2020 2020-03-31 2 Toshiba Electronic Devices & Storage Corporation Rev.2.0