TLP2372(TPL,E Toshiba

TLP2372 Photocouplers Infrared LED & Photo IC TLP2372TLP2372TLP2372TLP2372 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Programmable Logic Controllers (PLCs) Industrial Inverters High-Speed Digital Interfacing for Instrumentation and Control Devices 2. 2. 2. 2. GeneralGeneralGeneralGeneral TLP2372 is 20 Mbps high speed photocoupler operated at low supply voltage in the small SO6 package. Since supply voltage of only 2.2 V is needed to operate TLP2372, building another power supply circuit is unnecessary even in using it in a low supply voltage system of 2.5 V LVCMOS level. Therefore, this product contributes to reduce the number of components. The low threshold input current (I ) of 1.6 mA (max) and the low supply current (I /I ) of 0.5 mA (max) FLH DDL DDH at entire operating temperature range of -40 to 125 enables TLP2372 to be driven from a microcontroller directly, and provides energy saving of systems. The detector has a totem-pole output stage with current sourcing and sinking capabilities. TLP2372 has an internal Faraday shield that provides a guaranteed common-mode transient immunity of 20 kV/s. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Package: SO6 (2) Data transfer rate: 20 Mbps (typ.) (3) Supply current: 0.5 mA (max) (4) Threshold input current: 1.6 mA (max) (5) Supply voltage: 2.2 to 5.5 V (6) Operating temperature range: -40 to 125 (7) Pulse width distortion: 20 ns (max) (8) Isolation voltage: 3750 Vrms (min) (9) Safety standards UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1)(Note 1)(Note 1) CQC-approved: GB4943.1, GB8898 Japan Factory (Pending) Note 1: When a VDE approved type is needed, please designate the Option (V4)Option (V4)Option (V4)Option (V4). Start of commercial production 2020-02 2020 2020-03-31 1 Toshiba Electronic Devices & Storage Corporation Rev.2.0TLP2372 4. 4. 4. 4. Packaging and Pin AssignmentPackaging and Pin AssignmentPackaging and Pin AssignmentPackaging and Pin Assignment 1: Anode 3: Cathode 4: GND 5: V (Output) O 6: V DD 11-4L1S 5. 5. 5. 5. Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note) Note: A 0.1-F bypass capacitor must be connected between pin 6 and pin 4. 6. 6. 6. 6. Principle of OperationPrinciple of OperationPrinciple of OperationPrinciple of Operation 6.1. 6.1. 6.1. 6.1. Truth TableTruth TableTruth TableTruth Table Input LED Output H ON H L OFF L 6.2. 6.2. 6.2. 6.2. Mechanical ParametersMechanical ParametersMechanical ParametersMechanical Parameters Characteristics Min Unit Creepage distances 5.0 mm Clearance 5.0 Internal isolation thickness 0.4 2020 2020-03-31 2 Toshiba Electronic Devices & Storage Corporation Rev.2.0