BYT56A, BYT56B, BYT56D, BYT56G, BYT56J, BYT56K, BYT56M Vishay Semiconductors Fast Avalanche Sinterglass Diode FEATURES Glass passivated junction Hermetically sealed package Low reverse current Soft recovery characteristics Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC 949588 Halogen-free according to IEC 61249-2-21 definition MECHANICAL DATA APPLICATIONS Case: SOD-64 Very fast rectification and switching diode Terminals: plated axial leads, solderable per MIL-STD-750, method 2026 Polarity: color band denotes cathode end Mounting position: any Weight: approx. 858 mg PARTS TABLE PART TYPE DIFFERENTIATION PACKAGE BYT56A V = 50 V I = 3 A SOD-64 R FAV BYT56B V = 100 V I = 3 A SOD-64 R FAV BYT56D V = 200 V I = 3 A SOD-64 R FAV BYT56G V = 400 V I = 3 A SOD-64 R FAV BYT56J V = 600 V I = 3 A SOD-64 R FAV BYT56K V = 800 V I = 3 A SOD-64 R FAV BYT56M V = 1000 V I = 3 A SOD-64 R FAV ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise specified) amb PARAMETER TEST CONDITION PART SYMBOL VALUE UNIT BYT56A V = V 50 V R RRM BYT56B V = V 100 V R RRM BYT56D V = V 200 V R RRM Reverse voltage = repetitive peak See electrical characteristics BYT56G V = V 400 V R RRM reverse voltage BYT56J V = V 600 V R RRM BYT56K V = V 800 V R RRM BYT56M V = V 1000 V R RRM Peak forward surge current t = 10 ms, half sine wave I 80 A p FSM On PC board I 1.5 A FAV Average forward current l = 10mm I 3A FAV Non repetitive reverse avalanche I = 0.4 A E 10 mJ (BR)R R energy Junction and storage temperature T = T - 55 to + 175 C j stg range Document Number: 86032 For technical questions within your region, please contact one of the following: www.vishay.com Rev. 1.7, 30-Jul-10 DiodesAmericas vishay.com, DiodesAsia vishay.com, DiodesEurope vishay.com 1 BYT56A, BYT56B, BYT56D, BYT56G, BYT56J, BYT56K, BYT56M Fast Avalanche Sinterglass Diode Vishay Semiconductors MAXIMUM THERMAL RESISTANCE (T = 25 C, unless otherwise specified) amb PARAMETER TEST CONDITION SYMBOL VALUE UNIT Lead length l = 10 mm, T = constant R 25 K/W L thJA Junction ambient On PC board with spacing 25 mm R 70 K/W thJA ELECTRICAL CHARACTERISTICS (T = 25 C, unless otherwise specified) amb PARAMETER TEST CONDITION PART SYMBOL MIN. TYP. MAX. UNIT Forward voltage I = 3 A V -- 1.4 V F F V = V I -- 5 A R RRM R Reverse current V = V , T = 150 C I - - 150 A R RRM j R Reverse recovery time I = 0.5 A, I = 1 A, i = 0.25 A t - - 100 ns F R R rr TYPICAL CHARACTERISTICS (T = 25 C, unless otherwise specified) amb 40 3.5 V = V R RRM half sinewave 3.0 30 2.5 R = 25 K/W thJA I = 10 mm 2.0 20 ll 1.5 1.0 R = 70 K/W 10 thJA PCB: d = 25 mm 0.5 T = constant L 0 0 0 5 10 15 202530 0 20 40 60 80 100 120 140 160 180 949462 l - Lead Length (mm) 16366 T - Ambient Temperature (C) amb Fig. 1 - Max. Thermal Resistance vs. Lead Length Fig. 3 - Max. Average Forward Current vs. Ambient Temperature 100 1000 V = V R RRM T = 175 C 10 j 100 1 T = 25 C j 0.1 10 0.01 0.001 1 0 0.5 1.0 1.5 2.0 2.5 3.0 25 50 75 100 125 150 175 V - Forward Voltage (V) T - Junction Temperature (C) 16365 16367 F j Fig. 2 - Max. Forward Current vs. Forward Voltage Fig. 4 - Max. Reverse Current vs. Junction Temperature www.vishay.com For technical questions within your region, please contact one of the following: Document Number: 86032 2 DiodesAmericas vishay.com, DiodesAsia vishay.com, DiodesEurope vishay.com Rev. 1.7, 30-Jul-10 I - Forward Current (A) R - Ther. Resist. Junction/Ambient (K/W) F thJA I - Reverse Current (A) I - Average Forward Current (A) R FAV