SiZF906DT www.vishay.com Vishay Siliconix Dual N-Channel 30 V (D-S) MOSFET with Schottky Diode FEATURES TrenchFET Gen IV power MOSFET SkyFET low-side MOSFET with integrated Schottky 100 % R and UIS tested g Material categorization: for definitions of compliance please see www.vishay.com/doc 99912 V /D APPLICATIONS N-Channel 1 IN 1 MOSFET CPU core power PRODUCT SUMMARY G /G HS 1 Computer / server peripherals CHANNEL-1 CHANNEL-2 G Return/S V /S -D POL 1 1 SW 1 2 V (V) 30 30 DS Synchronous buck converter R max. () at V = 10 V 0.00380 0.00117 DS(on) GS Telecom DC/DC R max. ( ) at V = 4.5 V 0.00530 0.00158 Schottky DS(on) GS G /G LS 2 Diode Q typ. (nC) 11 46 g a I (A) 60 60 N-Channel 2 D MOSFET GND/S Configuration Dual 2 ORDERING INFORMATION Package PowerPAIR 6 x 5F Lead (Pb)-free and halogen-free SiZF906DT-T1-GE3 ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise noted) A PARAMETER SYMBOL CHANNEL-1CHANNEL-2UNIT Drain-source voltage V 30 30 DS V Gate-source voltage V +20, -16 +20, -16 GS a a T = 25 C 60 60 C a a T = 70 C 60 60 C Continuous drain current (T = 150 C) I J D b, c b, c T = 25 C 27 52 A b, c b, c T = 70 C 21.7 41 A A Pulsed drain current (t = 100 s) I 80 100 DM a T = 25 C 31.6 60 C Continuous source-drain diode current I S b, c b, c T = 25 C 3.7 4.1 A Single pulse avalanche current I 18 19 AS L = 0.1 mH Single pulse avalanche energy E 16 18 mJ AS T = 25 C 38 83 C T = 70 C 24 53 C Maximum power dissipation P W D b, c b, c T = 25 C 4.5 5 A b, c b, c T = 70 C 2.9 3.2 A Operating junction and storage temperature range T , T -55 to +150 J stg C d, e Soldering recommendations (peak temperature) 260 THERMAL RESISTANCE RATINGS CHANNEL-1 CHANNEL-2 PARAMETER SYMBOL UNIT TYP. MAX. TYP. MAX. b, f Maximum junction-to-ambient t 10 s R 22 28 20 25 thJA C/W Maximum junction-to-case (source) Steady state R 2.6 3.3 1.2 1.5 thJC Notes a. Package limited b. Surface mounted on 1 x 1 FR4 board c. t = 10 s d. See solder profile (www.vishay.com/doc 73257). The PowerPAIR is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components f. Maximum under steady state conditions is 60 C/W for channel-1 and 60 C/W for channel-2 S19-0288 Rev. B, 08-Apr-2019 Document Number: 67547 1 For technical questions, contact: pmostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 SiZF906DT www.vishay.com Vishay Siliconix SPECIFICATIONS (T = 25 C, unless otherwise noted) J PARAMETER SYMBOL TEST CONDITIONS MIN.TYP.MAX.UNIT Static Ch-1 30 - - Drain-source breakdown voltage V V = 0 V, I = 250 A DS GS D Ch-2 30 - - c Ch-1 36 - - Drain-source breakdown voltage V V = 0 V, t 1 s V DSt GS (transient) (transient) Ch-2 36 - - Ch-1 1.1 - 2.2 Gate-source threshold voltage V V = V , I = 250 A GS(th) DS GS D Ch-2 1.1 - 2.2 Ch-1 - - 100 Gate-source leakage I V = 0 V, V = +20 V, -16 V nA GSS DS GS Ch-2 - - 100 Ch-1 - - 1 V = 30 V, V = 0 V DS GS Ch-2 - 50 250 Zero Gate voltage drain current I A DSS Ch-1 - - 5 V = 30 V, V = 0 V, T = 55 C DS GS J Ch-2 - 300 3000 Ch-1 20 - - b On-state drain current I V 5 V, V = 10 V A D(on) DS GS Ch-2 20 - - V = 10 V, I = 15 A Ch-1 - 0.00300 0.00380 GS D V = 10 V, I = 20 A Ch-2 - 0.00090 0.00117 GS D b Drain-source on-state resistance R DS(on) V = 4.5 V, I = 10 A Ch-1 - 0.00400 0.00530 GS D V = 4.5 V, I = 15 A Ch-2 - 0.00120 0.00158 GS D V = 10 V, I = 15 A Ch-1 - 130 - DS D b Forward transconductance g S fs V = 10 V, I = 20 A Ch-2 130 - DS D a Dynamic Ch-1 - 2000 - Input capacitance C iss Ch-2 - 8200 - Channel-1 Ch-1 - 680 - Output capacitance C pF oss V = 15 V, V = 0 V, f = 1 MHz DS GS Ch-2 - 3700 - Ch-1 - 50 - Channel-2 Reverse transfer capacitance C rss Ch-2 - 260 - V = 15 V, V = 0 V, f = 1 MHz DS GS Ch-1 - 0.025 0.050 C /C ratio rss iss Ch-2 0.033 0.070 Ch-1 - 24.5 49 V = 15 V, V = 10 V, I = 20 A DS GS D Ch-2 - 100 200 Total gate charge Q g Ch-1 11 22 Channel-1 Ch-2 - 46 92 V = 15 V, V = 4.5 V, I = 20 A DS GS D Ch-1 - 5.1 - Gate-source charge Q nC gs Ch-2 - 17.1 - Channel-2 Ch-1 - 1.3 - V = 15 V, V = 4.5 V, I = 20 A DS GS D Gate-drain charge Q gd Ch-2 - 7.2 - Ch-1 - 21 - Output charge Q V = 15 V, V = 0 V oss DS GS Ch-2 - 96 - Ch-1 0.2 1 2 Gate resistance R f = 1 MHz g Ch-2 0.12 0.6 1.2 S19-0288 Rev. B, 08-Apr-2019 Document Number: 67547 2 For technical questions, contact: pmostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000