X-On Electronics has gained recognition as a prominent supplier of W25M02GVZEIT Multichip Packages across the USA, India, Europe, Australia, and various other global locations. W25M02GVZEIT Multichip Packages are a product manufactured by Winbond. We provide cost-effective solutions for Multichip Packages, ensuring timely deliveries around the world.

W25M02GVZEIT Winbond

W25M02GVZEIT electronic component of Winbond
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Part No.W25M02GVZEIT
Manufacturer: Winbond
Category: Multichip Packages
Description: Multichip Packages 2G-bit Serial NAND flash, 3V
Datasheet: W25M02GVZEIT Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 1
Multiples : 1
1 : USD 9.1941
10 : USD 6.1032
25 : USD 5.991
50 : USD 5.9461
N/A

Obsolete
   
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RoHS - XON
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We are delighted to provide the W25M02GVZEIT from our Multichip Packages category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25M02GVZEIT and other electronic components in the Multichip Packages category and beyond.

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W25M02GV Featuring 3V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ CONCURRENT OPERATIONS Publication Release Date: May 17, 2021 Revision I W25M02GV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 6 2. FEATURES ....................................................................................................................................... 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 7 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 7 3.2 Pad Description WSON 8x6-mm .......................................................................................... 7 3.3 Pin Configuration SOIC 300-mil ........................................................................................... 8 3.4 Pin Description SOIC 300-mil ............................................................................................... 8 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 9 3.6 Ball Description TFBGA 8x6-mm ......................................................................................... 9 4. PIN DESCRIPTIONS ...................................................................................................................... 10 4.1 Serial MCP (SpiStack ) Device Configuration ................................................................... 10 4.2 Chip Select (/CS) ................................................................................................................ 10 4.3 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................. 10 4.4 Write Protect (/WP) ............................................................................................................. 11 4.5 HOLD (/HOLD) ................................................................................................................... 11 4.6 Serial Clock (CLK) .............................................................................................................. 11 5. SINGLE DIE (W25N01GV) BLOCK DIAGRAM .............................................................................. 12 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 13 6.1 Device Operation Flow ....................................................................................................... 13 6.1.1 Stacked Die Operations ........................................................................................................ 13 6.1.2 Standard SPI Instructions ..................................................................................................... 13 6.1.3 Dual SPI Instructions ............................................................................................................ 14 6.1.4 Quad SPI Instructions ........................................................................................................... 14 6.1.5 Hold Function ........................................................................................................................ 14 6.2 Write Protection .................................................................................................................. 15 7. PROTECTION, CONFIGURATION AND STATUS REGISTERS .................................................. 16 7.1 Protection Register / Status Register-1 (Volatile Writable, OTP lockable) ......................... 16 7.1.1 Block Protect Bits (BP3, BP2, BP1, BP0, TB) Volatile Writable, OTP lockable .................. 16 7.1.2 Write Protection Enable Bit (WP-E) Volatile Writable, OTP lockable ................................. 17 7.1.3 Status Register Protect Bits (SRP1, SRP0) Volatile Writable, OTP lockable ..................... 17 7.2 Configuration Register / Status Register-2 (Volatile Writable) ........................................... 18 7.2.1 One Time Program Lock Bit (OTP-L) OTP lockable .......................................................... 18 7.2.2 Enter OTP Access Mode Bit (OTP-E) Volatile Writable ..................................................... 18 7.2.3 Status Register-1 Lock Bit (SR1-L) OTP lockable ............................................................. 18 7.2.4 ECC Enable Bit (ECC-E) Volatile Writable ......................................................................... 19 7.2.5 Buffer Read / Continuous Read Mode Bit (BUF) Volatile Writable ..................................... 20 7.3 Status Register-3 (Status Only) .......................................................................................... 21 7.3.1 Look-Up Table Full (LUT-F) Status Only ............................................................................ 21 7.3.2 Cumulative ECC Status (ECC-1, ECC-0) Status Only ....................................................... 21 7.3.3 Program Failure (P-FAIL) Status Only ............................................................................... 22 7.3.4 Erase Failure (E-FAIL) Status Only ................................................................................... 22 7.3.5 Write Enable Latch (WEL) Status Only .............................................................................. 22 - 1 -

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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