X-On Electronics has gained recognition as a prominent supplier of W71NW10GE3FW Multichip Packages across the USA, India, Europe, Australia, and various other global locations. W71NW10GE3FW Multichip Packages are a product manufactured by Winbond. We provide cost-effective solutions for Multichip Packages, ensuring timely deliveries around the world.

W71NW10GE3FW Winbond

Name: W71NW10GE3FW
Brand: Winbond
SKU: W71NW10GE3FW_Winbond
Availability: OutOfStock
Rating: 5 (11 reviews)

W71NW10GE3FW electronic component of Winbond

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See Product Specifications

Part No.	W71NW10GE3FW
Manufacturer:	Winbond
Category:	Multichip Packages
Description:	Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR2 MCP x8/x32
Datasheet:
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

2000: USD 5.698 ea
Line Total: USD 11396

Availability - 0

MOQ: 2000 Multiples: 2000
Pack Size: 2000

W71NW10GE3FW More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
0 Ship by Wed. 27 Nov to Fri. 29 Nov MOQ : 2000 Multiples : 2000	2000 : USD 5.698

Specifications

Manufacturer Winbond Winbond
Product Category Multichip Packages Multichip Packages
Type NAND Flash, LPDDR2 NAND Flash, LPDDR2
Memory Size 1 Gbit , 512 Mbit 1 Gbit , 512 Mbit
Series W71NW10GE W71NW10GE
Mounting Style SMD/SMT SMD/SMT
Maximum Clock Frequency 29 MHz , 400 MHz 29 MHz , 400 MHz
Minimum Operating Temperature - 40 C - 40 C
Maximum Operating Temperature + 85 C + 85 C
Hts Code 8542320051 8542320051

We are delighted to provide the W71NW10GE3FW from our Multichip Packages category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W71NW10GE3FW and other electronic components in the Multichip Packages category and beyond.

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HS Compliance

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory

Winbond Elec may also be referenced as

WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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