X-On Electronics has gained recognition as a prominent supplier of W71NW10GF3FW Multichip Packages across the USA, India, Europe, Australia, and various other global locations. W71NW10GF3FW Multichip Packages are a product manufactured by Winbond. We provide cost-effective solutions for Multichip Packages, ensuring timely deliveries around the world.

W71NW10GF3FW Winbond

W71NW10GF3FW electronic component of Winbond
W71NW10GF3FW Winbond
W71NW10GF3FW Multichip Packages
W71NW10GF3FW  Semiconductors

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See Product Specifications
Part No. W71NW10GF3FW
Manufacturer: Winbond
Category: Multichip Packages
Description: Multichip Packages 1G-bit 1.8V NAND + 1G-bit LPDDR2 MCP x8/x32
Datasheet:
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
2000: USD 6.633 ea
Line Total: USD 13266 
Availability - 0
MOQ: 2000  Multiples: 2000
Pack Size: 2000
Availability Price Quantity
0
Ship by Thu. 06 Feb to Mon. 10 Feb
MOQ : 2000
Multiples : 2000
2000 : USD 6.633

   
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We are delighted to provide the W71NW10GF3FW from our Multichip Packages category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W71NW10GF3FW and other electronic components in the Multichip Packages category and beyond.

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Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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