X-On Electronics has gained recognition as a prominent supplier of W71NW20GD3DW Multichip Packages across the USA, India, Europe, Australia, and various other global locations. W71NW20GD3DW Multichip Packages are a product manufactured by Winbond. We provide cost-effective solutions for Multichip Packages, ensuring timely deliveries around the world.

W71NW20GD3DW Winbond

W71NW20GD3DW electronic component of Winbond
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Part No.W71NW20GD3DW
Manufacturer: Winbond
Category: Multichip Packages
Description: Multichip Packages 2G-bit 1.8V NAND + 1G-bit LPDDR1 MCP x8/x32
Datasheet:
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
2500: USD 8.3704 ea
Line Total: USD 20926 
Availability - 0
MOQ: 2500  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 2500
Multiples : 1
2500 : USD 8.3704
25000 : USD 8.1789
250000 : USD 7.0662
1250000 : USD 6.4965
2500000 : USD 6.4916

0
Ship by Wed. 25 Dec to Fri. 27 Dec
MOQ : 2500
Multiples : 2500
2500 : USD 7.2534

   
Manufacturer
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Memory Size
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Maximum Clock Frequency
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the W71NW20GD3DW from our Multichip Packages category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W71NW20GD3DW and other electronic components in the Multichip Packages category and beyond.

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Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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