X-On Electronics has gained recognition as a prominent supplier of W71NW20GF3FW Multichip Packages across the USA, India, Europe, Australia, and various other global locations. W71NW20GF3FW Multichip Packages are a product manufactured by Winbond. We provide cost-effective solutions for Multichip Packages, ensuring timely deliveries around the world.

W71NW20GF3FW Winbond

W71NW20GF3FW electronic component of Winbond
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Part No.W71NW20GF3FW
Manufacturer: Winbond
Category: Multichip Packages
Description: Multichip Packages 2G-bit 1.8V NAND + 1G-bit LPDDR2 MCP x8/x32
Datasheet:
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
2000: USD 9.4324 ea
Line Total: USD 18864.8 
Availability - 0
MOQ: 2000  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ : 2000
Multiples : 1
2000 : USD 9.4324
20000 : USD 9.2157
200000 : USD 7.9581
1000000 : USD 7.3206
2000000 : USD 7.3143

0
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ : 2000
Multiples : 2000
2000 : USD 7.8193

   
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the W71NW20GF3FW from our Multichip Packages category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W71NW20GF3FW and other electronic components in the Multichip Packages category and beyond.

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Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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