X-On Electronics has gained recognition as a prominent supplier of W9816G6JH-6 DRAM across the USA, India, Europe, Australia, and various other global locations. W9816G6JH-6 DRAM are a product manufactured by Winbond. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

W9816G6JH-6 Winbond

W9816G6JH-6 electronic component of Winbond
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Part No.W9816G6JH-6
Manufacturer: Winbond
Category: DRAM
Description: DRAM Chip SDRAM 16Mbit 1Mx16 3.3V 50-Pin TSOP-II
Datasheet: W9816G6JH-6 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1.744 ea
Line Total: USD 1.74 
Availability - 327
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
327
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ : 1
Multiples : 1
1 : USD 1.744
10 : USD 1.4784
100 : USD 1.3282
500 : USD 1.3167
702 : USD 1.2705
2808 : USD 1.2012

   
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We are delighted to provide the W9816G6JH-6 from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W9816G6JH-6 and other electronic components in the DRAM category and beyond.

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W9816G6JH 512K 2 BANKS 16 BITS SDRAM Table of Contents- 1. GENERAL DESCRIPTION ......................................................................................................... 3 2. FEATURES ................................................................................................................................. 3 3. ORDER INFORMATION ............................................................................................................. 4 4. PIN CONFIGURATION ............................................................................................................... 4 5. PIN DESCRIPTION ..................................................................................................................... 5 6. BLOCK DIAGRAM ...................................................................................................................... 6 7. FUNCTIONAL DESCRIPTION.................................................................................................... 7 7.1 Power Up and Initialization ............................................................................................. 7 7.2 Programming Mode Register .......................................................................................... 7 7.3 Bank Activate Command ................................................................................................ 7 7.4 Read and Write Access Modes ...................................................................................... 7 7.5 Burst Read Command .................................................................................................... 8 7.6 Burst Write Command .................................................................................................... 8 7.7 Read Interrupted by a Read ........................................................................................... 8 7.8 Read Interrupted by a Write ............................................................................................ 8 7.9 Write Interrupted by a Write ............................................................................................ 8 7.10 Write Interrupted by a Read ............................................................................................ 8 7.11 Burst Stop Command ..................................................................................................... 9 7.12 Addressing Sequence of Sequential Mode .................................................................... 9 7.13 Addressing Sequence of Interleave Mode ...................................................................... 9 7.14 Auto-precharge Command ........................................................................................... 10 7.15 Precharge Command .................................................................................................... 10 7.16 Self Refresh Command ................................................................................................ 10 7.17 Power Down Mode ....................................................................................................... 11 7.18 No Operation Command ............................................................................................... 11 7.19 Deselect Command ...................................................................................................... 11 7.20 Clock Suspend Mode .................................................................................................... 11 8. OPERATION MODE ................................................................................................................. 12 9. ELECTRICAL CHARACTERISTICS ......................................................................................... 13 9.1 Absolute Maximum Ratings .......................................................................................... 13 9.2 Recommended DC Operating Conditions .................................................................... 13 9.3 Capacitance .................................................................................................................. 13 9.4 DC Characteristics ........................................................................................................ 14 9.5 AC Characteristics ........................................................................................................ 15 10. TIMING WAVEFORMS ............................................................................................................. 17 10.1 Command Input Timing ................................................................................................ 17 10.2 Read Timing .................................................................................................................. 18 10.3 Control Timing of Input/Output Data ............................................................................. 19 10.4 Mode Register Set Cycle .............................................................................................. 20 Publication Release Date: Dec. 27, 2016 Revision: A02 - 1 - W9816G6JH 11. OPERATING TIMING EXAMPLE ............................................................................................. 21 11.1 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3) ...................................... 21 11.2 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3, Auto-precharge) ........... 22 11.3 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3) ...................................... 23 11.4 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3, Auto-precharge) ........... 24 11.5 Interleaved Bank Write (Burst Length = 8) ................................................................... 25 11.6 Interleaved Bank Write (Burst Length = 8, Auto-precharge) ........................................ 26 11.7 Page Mode Read (Burst Length = 4, CAS Latency = 3) .............................................. 27 11.8 Page Mode Read / Write (Burst Length = 8, CAS Latency = 3) ................................... 28 11.9 Auto Precharge Read (Burst Length = 4, CAS Latency = 3) ........................................ 29 11.10 Auto Precharge Write (Burst Length = 4) .................................................................... 30 11.11 Auto Refresh Cycle ..................................................................................................... 31 11.12 Self Refresh Cycle ....................................................................................................... 32 11.13 Burst Read and Single Write (Burst Length = 4, CAS Latency = 3)............................ 33 11.14 Power Down Mode ...................................................................................................... 34 11.15 Auto-precharge Timing (Read Cycle) .......................................................................... 35 11.16 Auto-precharge Timing (Write Cycle) .......................................................................... 36 11.17 Timing Chart of Read to Write Cycle ........................................................................... 37 11.18 Timing Chart of Write to Read Cycle ........................................................................... 37 11.19 Timing Chart of Burst Stop Cycle (Burst Stop Command) .......................................... 38 11.20 Timing Chart of Burst Stop Cycle (Precharge Command) .......................................... 38 11.21 CKE/DQM Input Timing (Write Cycle) ......................................................................... 39 11.22 CKE/DQM Input Timing (Read Cycle) ......................................................................... 40 12. PACKAGE SPECIFICATION .................................................................................................... 41 13. REVISION HISTORY ................................................................................................................ 42 Publication Release Date: Dec. 27, 2016 Revision: A02 - 2 -

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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