X-On Electronics has gained recognition as a prominent supplier of C3M0160120J SiC MOSFETs across the USA, India, Europe, Australia, and various other global locations. C3M0160120J SiC MOSFETs are a product manufactured by Wolfspeed. We provide cost-effective solutions for SiC MOSFETs, ensuring timely deliveries around the world.

C3M0160120J Wolfspeed

C3M0160120J electronic component of Wolfspeed
C3M0160120J Wolfspeed
C3M0160120J SiC MOSFETs
C3M0160120J  Semiconductors

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See Product Specifications
Part No. C3M0160120J
Manufacturer: Wolfspeed
Category: SiC MOSFETs
Description: SiC MOSFETs SiC, MOSFET, 160mohm, 1200V, TO-263-7, Industrial
Datasheet: C3M0160120J Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 9.9 ea
Line Total: USD 9.9 
Availability - 1306
Ship by Thu. 23 Jan to Mon. 27 Jan
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
1306
Ship by Thu. 23 Jan to Mon. 27 Jan
MOQ : 1
Multiples : 1
1 : USD 9.9
10 : USD 9.218
50 : USD 6.611
100 : USD 6.347
5000 : USD 6.336

   
Manufacturer
Product Category
Mounting Style
Transistor Polarity
Number of Channels
Vds - Drain-Source Breakdown Voltage
Id - Continuous Drain Current
Rds On - Drain-Source Resistance
Vgs - Gate-Source Voltage
Vgs th - Gate-Source Threshold Voltage
Qg - Gate Charge
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Channel Mode
Package / Case
Hts Code
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the C3M0160120J from our SiC MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the C3M0160120J and other electronic components in the SiC MOSFETs category and beyond.

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V 1200 V DS I @ 25C 17 A D C3M0160120J R 160 m DS(on) Silicon Carbide Power MOSFET TM C3M MOSFET Technology N-Channel Enhancement Mode Features Package 3rd generation SiC MOSFET technology TAB Drain Low impedance package with driver source pin 7mm of creepage distance between drain and source High blocking voltage with low on-resistance High-speed switching with low capacitances Fast intrinsic diode with low reverse recovery (Q ) rr Halogen free, RoHS compliant 1 2 3 4 5 6 7 G KS S S S S S Benefits Drain (TAB) Reduce switching losses and minimize gate ringing Higher system efficiency Reduce cooling requirements Increase power density Gate (Pin 1) Increase system switching frequency Driver Power Source Source (Pin 2) (Pin 3,4,5,6,7) Applications Renewable energy High voltage DC/DC converters Switch Mode Power Supplies Marking Part Number Package UPS C3M0160120J TO-263-7 C3M0160120J Maximum Ratings (T = 25 C unless otherwise specified) C Unit Symbol Parameter Value Test Conditions Note Drain - Source Voltage 1200 V V = 0 V, I = 100 A V GS D DSmax Gate - Source Voltage (dynamic) -8/+19 V AC (f >1 Hz) Note: 1 V GSmax Gate - Source Voltage (static) -4/+15 V Static Note: 2 V GSop 17 Fig. 19 V = 15 V, T = 25C GS C I Continuous Drain Current A D 12 V = 15 V, T = 100C GS C I Pulsed Drain Current 34 A Fig. 22 Pulse width t limited by T D(pulse) jmax P P Power Dissipation 90 W T =25C, T = 150 C Fig. 20 C J D -55 to Operating Junction and Storage Temperature C T , T J stg +150 Solder Temperature 260 C 1.6mm (0.063) from case for 10s T L Note (1): When using MOSFET Body Diode V = -4V/+19V GSmax Note (2): MOSFET can also safely operate at 0/+15 V 1 C3M0160120J Rev. A, 04-2020Electrical Characteristics (T = 25C unless otherwise specified) C Symbol Parameter Min. Typ. Max. Unit Test Conditions Note V Drain-Source Breakdown Voltage 1200 V V = 0 V, I = 100 A (BR)DSS GS D 1.8 2.8 3.6 V VDS = VGS, ID = 2.33 mA V Gate Threshold Voltage Fig. 11 GS(th) 2.2 V V = V , I = 2.33 mA, T = 150C DS GS D J I Zero Gate Voltage Drain Current 1 50 A V = 1200 V, V = 0 V DSS DS GS I Gate-Source Leakage Current 10 250 nA V = 15 V, V = 0 V GSS GS DS 160 208 VGS = 15 V, ID = 8.5 A Fig. 4, R Drain-Source On-State Resistance m DS(on) 5, 6 256 VGS = 15 V, ID = 8.5 A, TJ = 150C 5.2 V = 20 V, I = 8.5 A DS DS gfs Transconductance S Fig. 7 4.9 V = 20 V, I = 8.5 A, T = 150C DS DS J Ciss Input Capacitance 632 Fig. 17, VGS = 0 V, VDS = 1000 V C Output Capacitance 39 oss pF 18 f = 1 MHz C Reverse Transfer Capacitance 3 rss AC V = 25 mV E C Stored Energy 22.5 J Fig. 16 oss oss E Turn-On Switching Energy (Body Diode FWD) 64 ON V = 800 V, V = -4 V/15 V, I = 8.5 A, DS GS Fig. 26, D J 29 R = 2.5 , L= 336 H G(ext) E Turn-Off Switching Energy (Body Diode FWD) 13 OFF td(on) Turn-On Delay Time 11 V = 800 V, V = -4 V/15 V DD GS tr Rise Time 8 I = 8.5 A, R = 0 , D G(ext) Fig. 27, ns Timing relative to V 28, 29 DS t Turn-Off Delay Time 14 d(off) Inductive load t Fall Time 8 f , R Internal Gate Resistance 8 f = 1 MHz V = 25 mV G(int) AC Q Gate to Source Charge 11 gs VDS = 800 V, VGS = -4 V/15 V Q Gate to Drain Charge 5 I = 8.5 A gd nC D Fig. 12 Per IEC60747-8-4 pg 21 Q Total Gate Charge 24 g (T = 25C unless otherwise specified) Reverse Diode Characteristics C Symbol Parameter Typ. Max. Unit Test Conditions Note 4.4 V V = -4 V, I = 3 A GS SD Fig. 8, VSD Diode Forward Voltage 9, 10 4.0 V V = -4 V, I = 3 A, T = 150 C GS SD J I Continuous Diode Forward Current 17 A V = -4 V Note 1 S GS IS, pulse Diode pulse Current 34 A Note 1 V = -4 V, pulse width t limited by T jmax GS P t Reverse Recover time 5 ns rr V = -4 V, I = 8.5 A, V = 800 V Note 1, GS SD R Q Reverse Recovery Charge 65 nC rr Fig. 29 dif/dt = 8925 A/s, T = 25 C J I Peak Reverse Recovery Current 19 A rrm t Reverse Recover time 7 ns rr V = -4 V, I = 8.5 A, V = 800 V Note 1, GS SD R Q Reverse Recovery Charge 32 nC rr Fig. 29 dif/dt = 2020 A/s, T = 25 C J I Peak Reverse Recovery Current 8 A rrm Thermal Characteristics Typ. Symbol Parameter Unit Test Conditions Note RJC Thermal Resistance from Junction to Case 1.38 C/W Fig. 21 2 C3M0160120J Rev. A, 04-2020

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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