FS770R08A6P2LBBPSA1 Infineon

HybridPACK Drive Module FS770R08A6P2LB Final Data Sheet V3.0, 2019-05-28 Automotive High PowerFS770R08A6P2LB HybridPACK Drive Module 1 Features / Description HybridPACK Drive module with EDT2 IGBT and Diode T T T VCES = 750 V I = 770 A C Typical Applications Description TM Automotive Applications The HybridPACK Drive is a very compact six-pack module optimized for hybrid and electric Hybrid Electrical Vehicles (H)EV vehicles. The product FS770R08A6P2FB comes Motor Drives with a flat baseplate and bonded cooling structure Commercial Agriculture Vehicles and is a 750V/770A module derivate within the HybridPACK Drive family. The power module implements the new EDT2 IGBT generation, which Electrical Features is an automotive Micro-Pattern Trench-Field-Stop Blocking voltage 750V cell design optimized for electric drive train applications. The chipset has benchmark current Low V CEsat density combined with short circuit ruggedness and Low Switching Losses increased blocking voltage for reliable inverter Low Qg and Crss operation under harsh environmental conditions. Low Inductive Design The EDT2 IGBTs also show excellent light load power losses, which helps to improve system Tvj op = 150C efficiency over a real driving cycle. The EDT2 IGBT Short-time extended Operation Temperature was optimized for applications with switching Tvj op = 175C frequencies in the range of 10 kHz. TM The new HybridPACK Drive power module family Mechanical Features comes with mechanical guiding elements 4.2kV DC 1sec Insulation supporting easy assembly processes for customers. High Creepage and Clearance Distances Furthermore, the press-fit pins for the signal Compact design terminals avoid additional time consuming selective solder processes, which provides cost savings on High Power Density system level and increases system reliability. The Direct Cooled Base Plate with Ribbon Bonds products in the HybridPACK Drive family with flat Guiding elements for PCB and cooler assembly baseplate FS660R08A6P2FB PinFin baseplate Integrated NTC temperature sensor FS820R08A6P2B as well as the FS770R08A6P2B derivate allow a very cost effective scaling for PressFIT Contact Technology different inverter power levels at a minimum inverter RoHS compliant design effort. UL 94 V0 module frame Product Name Ordering Code FS770R08A6P2LB SP001706976 Final Data Sheet 2 V3.0, 2019-05-28