TYPICAL PERFORMANCE CURVES APT40GP60B2DQ2(G) 600V APT40GP60B2DQ2 APT40GP60B2DQ2G* *G Denotes RoHS Compliant, Pb Free Terminal Finish. POWER MOS 7 IGBT TM T-Max The POWER MOS 7 IGBT is a new generation of high voltage power IGBTs. Using Punch Through Technology this IGBT is ideal for many high frequency, high voltage switching applications and has been optimized for high frequency switchmode power supplies. G C E Low Conduction Loss 100 kHz operation 400V, 41A Low Gate Charge 200 kHz operation 400V, 26A C Ultrafast Tail Current shutoff SSOA Rated G E MAXIMUM RATINGS All Ratings: T = 25C unless otherwise specied. C Symbol Parameter UNIT APT40GP60B2DQ2(G) V Collector-Emitter Voltage 600 CES Volts V Gate-Emitter Voltage 20 GE 7 I Continuous Collector Current T = 25C 100 C1 C I Continuous Collector Current T = 110C 62 Amps C2 C 1 I Pulsed Collector Current T = 150C 160 CM C Switching Safe Operating Area T = 150C SSOA 160A 600V J P Total Power Dissipation Watts 543 D T ,T Operating and Storage Junction Temperature Range -55 to 150 J STG C T Max. Lead Temp. for Soldering: 0.063 from Case for 10 Sec. L 300 STATIC ELECTRICAL CHARACTERISTICS Symbol Characteristic / Test Conditions MIN TYP MAX Units V Collector-Emitter Breakdown Voltage (V = 0V, I = 250A) 600 (BR)CES GE C V Gate Threshold Voltage (V = V , I = 1mA, T = 25C) GE(TH) 3 4.5 6 CE GE C j Volts Collector-Emitter On Voltage (V = 15V, I = 40A, T = 25C) 2.2 2.7 GE C j V CE(ON) Collector-Emitter On Voltage (V = 15V, I = 40A, T = 125C) 2.1 GE C j 2 Collector Cut-off Current (V = 600V, V = 0V, T = 25C) 500 CE GE j I A CES 2 Collector Cut-off Current (V = 600V, V = 0V, T = 125C) 3000 CE GE j I nA Gate-Emitter Leakage Current (V = 20V) GES 100 GE CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. APT Website - DYNAMIC CHARACTERISTICS APT40GP60B2DQ2(G) Symbol Characteristic Test Conditions MIN TYP MAX UNIT C 4610 Input Capacitance Capacitance ies C pF 395 Output Capacitance V = 0V, V = 25V oes GE CE C f = 1 MHz 25 Reverse Transfer Capacitance res V V Gate-to-Emitter Plateau Voltage Gate Charge 7.5 GEP 3 Q V = 15V Total Gate Charge 135 g GE V = 300V Q nC Gate-Emitter Charge 30 CE ge I = 40A Q C 40 Gate-Collector Mille) Charge gc T = 150C, R = 5, V = J G GE Switching Safe Operating Area SSOA A 160 15V, L = 100H,V = 600V CE t Inductive Switching (25C) Turn-on Delay Time d(on) 20 V = 400V t Current Rise Time 29 CC r ns t V = 15V Turn-off Delay Time d(off) GE 64 I = 40A t C Current Fall Time 45 f R = 5 4 G E Turn-on Switching Energy 385 on1 T = +25C 5 J E J Turn-on Switching Energy (Diode) 645 on2 6 E Turn-off Switching Energy 350 450 off t Inductive Switching (125C) Turn-on Delay Time d(on) 20 t V =400V Current Rise Time 29 r CC ns V = 15V t Turn-off Delay Time GE d(off) 90 I = 40A t C Current Fall Time f 70 R = 5 4 4 G E Turn-on Switching Energy 385 on1 T = +125C 55 J E J Turn-on Switching Energy (Diode) 970 on2 6 E Turn-off Switching Energy 615 950 off THERMAL AND MECHANICAL CHARACTERISTICS Symbol Characteristic UNIT MIN TYP MAX R Junction to Case (IGBT) .23 JC C/W R Junction to Case (DIODE) .67 JC W Package Weight gm 5.9 T 1 Repetitive Rating: Pulse width limited by maximum junction temperature. 2 For Combi devices, I includes both IGBT and FRED leakages ces 3 See MIL-STD-750 Method 3471. 4 E is the clam ped inductive turn-on-energy of the IGBT only, without the effect of a commutating diode reverse recovery current on1 adding to the IGBT turn-on loss. (See Figure 24.) 5 E is the clamped inductive turn-on energy that includes a commutating diode reverse recovery current in the IGBT turn-on switching on2 loss. (See Figures 21, 22.) 6 E is the clamped inductive turn-off energy measured in accordance with JEDEC standard JESD24-1. (See Figures 21, 23.) off Repetitive Rating: Pulse width limited by maximum junction temperature. 7 Continuous current limited by package lead temperature/ APT Reserves the right to change, without notice, the specications and information contained herein. 050-7493 Rev A 5-2005