TYPICAL PERFORMANCE CURVES APT50GP60B2DQ2(G) 600V APT50GP60B2DQ2 APT50GP60B2DQ2G* *G Denotes RoHS Compliant, Pb Free Terminal Finish. (B2) POWER MOS 7 IGBT T-Max The POWER MOS 7 IGBT is a new generation of high voltage power IGBTs. Using Punch Through Technology this IGBT is ideal for many high frequency, high voltage switching applications and has been optimized for high frequency switchmode power supplies. Low Conduction Loss SSOA Rated Low Gate Charge C Ultrafast Tail Current shutoff G E MAXIMUM RATINGS All Ratings: T = 25C unless otherwise specied. C Symbol Parameter UNIT APT50GP60B2DQ2(G) V Collector-Emitter Voltage 600 CES Volts V Gate-Emitter Voltage 30 GE 7 I Continuous Collector Current T = 25C 150 C1 C Continuous Collector Current T = 110C I 72 Amps C C2 1 Pulsed Collector Current I 190 CM Switching Safe Operating Area T = 150C SSOA 190A 600V J P Total Power Dissipation Watts 625 D T ,T Operating and Storage Junction Temperature Range -55 to 150 J STG C T Max. Lead Temp. for Soldering: 0.063 from Case for 10 Sec. L 300 STATIC ELECTRICAL CHARACTERISTICS Symbol Characteristic / Test Conditions MIN TYP MAX Units V Collector-Emitter Breakdown Voltage (V = 0V, I = 525A) 600 (BR)CES GE C V Gate Threshold Voltage (V = V , I = 1mA, T = 25C) GE(TH) 3 4.5 6 CE GE C j Volts Collector-Emitter On Voltage (V = 15V, I = 50A, T = 25C) 2.2 2.7 GE C j V CE(ON) Collector-Emitter On Voltage (V = 15V, I = 50A, T = 125C) 2.1 GE C j 2 Collector Cut-off Current (V = 600V, V = 0V, T = 25C) 525 CE GE j I A CES 2 Collector Cut-off Current (V = 600V, V = 0V, T = 125C) 3000 CE GE j I Gate-Emitter Leakage Current (V = 20V) nA GES 100 GE CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. APT Website - DYNAMIC CHARACTERISTICS APT50GP60B2DQ2(G) Symbol Characteristic Test Conditions MIN TYP MAX UNIT C 5700 Input Capacitance Capacitance ies C pF 465 Output Capacitance V = 0V, V = 25V oes GE CE C f = 1 MHz 30 Reverse Transfer Capacitance res V V Gate-to-Emitter Plateau Voltage Gate Charge 7.5 GEP 3 Q V = 15V Total Gate Charge 165 g GE V = 300V Q nC Gate-Emitter Charge 40 CE ge I = 50A Q C 50 Gate-Collector Mille) Charge gc T = 150C, R = 4.3, V = J G GE Switching Safe Operating Area SSOA A 190 15V, L = 100H,V = 600V CE t Inductive Switching (25C) Turn-on Delay Time d(on) 19 V = 400V t Current Rise Time 36 CC r ns t V = 15V Turn-off Delay Time d(off) GE 85 I = 50A t C Current Fall Time 60 f R = 4.3 4 G E Turn-on Switching Energy 465 on1 T = +25C 5 J E J Turn-on Switching Energy (Diode) 835 on2 6 E Turn-off Switching Energy 635 off t Inductive Switching (125C) Turn-on Delay Time d(on) 19 t V = 400V Current Rise Time 36 r CC ns V = 15V t Turn-off Delay Time GE d(off) 115 I = 50A t C Current Fall Time f 85 R = 4.3 4 4 G E Turn-on Switching Energy 465 on1 T = +125C 55 J E J Turn-on Switching Energy (Diode) 1260 on2 6 E Turn-off Switching Energy 1060 off THERMAL AND MECHANICAL CHARACTERISTICS Symbol Characteristic UNIT MIN TYP MAX R Junction to Case (IGBT) .20 JC C/W R Junction to Case (DIODE) .67 JC W Package Weight gm 6.10 T 1 Repetitive Rating: Pulse width limited by maximum junction temperature. 2 For Combi devices, I includes both IGBT and FRED leakages ces 3 See MIL-STD-750 Method 3471. 4 E is the clam ped inductive turn-on-energy of the IGBT only, without the effect of a commutating diode reverse recovery current on1 adding to the IGBT turn-on loss. (See Figure 24.) 5 E is the clamped inductive turn-on energy that includes a commutating diode reverse recovery current in the IGBT turn-on switching on2 loss. (See Figures 21, 22.) 6 E is the clamped inductive turn-off energy measured in accordance with JEDEC standard JESD24-1. (See Figures 21, 23.) off 7 Continuous current limited by package lead temperature. APT Reserves the right to change, without notice, the specications and information contained herein. 050-7495 Rev A 11-2005