BYV29-600,127 NXP

BYV29-600 Rectier diode ultrafast Rev. 02 24 October 2007 Product data sheet 1. Product prole 1.1 General description Ultrafast, epitaxial rectier diode in a SOD59 (TO-220AC) plastic package. 1.2 Features n Fast switching n Low thermal resistance n Soft recovery characteristic n High thermal cycling performance n Low forward voltage drop 1.3 Applications n High frequency switched-mode power n Discontinuous Current Mode (DCM) supplies Power Factor Correction (PFC) 1.4 Quick reference data n V 600 V n I 9A RRM F(AV) n V 1.11 V n t 60 ns F rr 2. Pinning information Table 1. Pinning Pin Description Simplied outline Symbol 1 cathode (k) mb k a 2 anode (a) 001aaa020 mb mounting base cathode 1 2 SOD59 (2-lead TO-220AC)BYV29-600 NXP Semiconductors Rectier diode ultrafast 3. Ordering information Table 2. Ordering information Type number Package Name Description Version BYV29-600 TO-220AC plastic single-ended package heatsink mounted 1 mounting hole 2-lead TO-220AC SOD59 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V repetitive peak reverse voltage - 600 V RRM V crest working reverse voltage - 600 V RWM V reverse voltage square waveform = 1.0 T 100 C - 600 V R mb I average forward current square waveform = 0.5 T 120 C-9A F(AV) mb I repetitive peak forward current square waveform = 0.5 T 120 C - 18 A FRM mb I non-repetitive peak forward current t = 10 ms sinusoidal waveform - 70 A FSM t = 8.3 ms sinusoidal waveform - 77 A T storage temperature - 40 +150 C stg T junction temperature - 150 C j 5. Thermal characteristics Table 4. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit R thermal resistance from junction to with heatsink compound - - 2.5 K/W th(j-mb) mounting base see Figure 1 R thermal resistance from junction to ambient in free air - 60 - K/W th(j-a) 001aag913 10 Z th(j-mb) (K/W) 1 t - 1 p 10 P d = T - 2 10 t t p T - 3 10 - 6 - 5 - 4 - 3 - 2 - 1 10 10 10 10 10 10 1 10 t (s) p Fig 1. Transient thermal impedance from junction to mounting base as a function of pulse width BYV29-600 2 NXP B.V. 2007. All rights reserved. Product data sheet Rev. 02 24 October 2007 2 of 8