ON Semiconductor Is Now To learn more about onsemi, please visit our website at www.onsemi.com onsemi andand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba onsemi or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided as-is and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. Typical parameters which may be provided in onsemi data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and holdo nsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. 5.5V ESD Protection Diode MicroPackaged Diodes for ESD Protection ESDM3551 The ESDM3551 is designed to protect voltage sensitive components that require low capacitance from ESD and transient voltage events. Excellent clamping capability, low capacitance, low leakage, and fast www.onsemi.com response time, make these parts ideal for ESD protection on designs where board space is at a premium. 1 2 Features Low Clamping Voltage Small Body Outline Dimensions: MARKING 0201: 0.62 mm x 0.32 mm DIAGRAMS 0402: 1.00 mm x 0.60 mm PIN 1 Low Body Height: 0.3 mm M X3DFN2 (0201) Standoff Voltage: 5.5 V CASE 152AF IEC6100042 Level 4 ESD Protection 5 = Specific Device Code SZESDM3551MX2WT5G* Wettable Flanks Device for optimal M = Date Code Automated Optical Inspection (AOI) (*Product Release in Q4 2019) SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements AECQ101 Qualified and JJ M PPAP Capable X2DFN2 (0402) CASE 714AB These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant JJ = Specific Device Code M = Date Code Typical Applications USB ID Line Protection SD Card Protection XXM X2DFNW2 Audio Line Protection CASE 711BG GPIO XX = Specific Device Code MAXIMUM RATINGS M = Date Code Rating Symbol Value Unit IEC 6100042 Contact ESD 30 kV ORDERING INFORMATION IEC 6100042 Air 30 ISO 10605 150 pF/2 k 30 Device Package Shipping ISO 10605 330 pF/2 k 30 30 ISO 10605 330 pF/330 ESDM3551MXT5G X3DFN2 10000 / (PbFree) Tape & Reel Total Power Dissipation on FR5 Board P 250 mW D (Note 1) T = 25C A ESDM3551N2T5G X2DFN2 8000 / Tape Thermal Resistance, JunctiontoAmbient 400 C/W R JA (PbFree) & Reel Junction and Storage Temperature Range T , T 55 to +150 C J stg SZESDM3551N2T5G X2DFN2 8000 / Tape Lead Solder Temperature Maximum T 260 C L (PbFree) & Reel (10 Second Duration) SZESDM3551MX2WT5G X2DFNW2 8000 / Tape Stresses exceeding those listed in the Maximum Ratings table may damage the (PbFree) & Reel device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR5 = 1.0 x 0.75 x 0.62 in. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. See Application Note AND8308/D for further description of survivability specs. Semiconductor Components Industries, LLC, 2017 1 Publication Order Number: November, 2019 Rev. 4 ESDM3551/D 5