ON Semiconductor Is Now To learn more about onsemi, please visit our website at www.onsemi.com onsemi andand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba onsemi or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided as-is and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. Typical parameters which may be provided in onsemi data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and holdo nsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. FDMA1029PZ Dual P-Channel PowerTrench MOSFET July 2014 FDMA1029PZ Dual P-Channel PowerTrench MOSFET General Description Features This device is designed specifically as a single package 3.1 A, 20V. R = 95 m V = 4.5V DS(ON) GS solution for the battery charge switch in cellular handset R = 141 m V = 2.5V DS(ON) GS and other ultra-portable applications. It features two Low profile 0.8 mm maximum in the new package independent P-Channel MOSFETs with low on-state MicroFET 2x2 mm resistance for minimum conduction losses. When HBM ESD protection level > 2.5kV (Note 3) connected in the typical common source configuration, RoHS Compliant bi-directional current flow is possible. The MicroFET 2x2 package offers exceptional thermal Free from halogenated compounds and antimony performance for its physical size and is well suited to oxides linear mode applications. PIN 1 S1 G1 D2 D1 D2 D1 S1 1 6 G1 2 5 G2 D1 G2 S2 3 D2 4 S2 MicroFET 2x2 o Absolute Maximum Ratings T =25 C unless otherwise noted A Symbol Parameter Ratings Units V Drain-Source Voltage 20 V DS V Gate-Source Voltage 12 V GS A Drain Current Continuous (Note 1a) 3.1 I D Pulsed 6 P W D Power Dissipation for Single Operation (Note 1a) 1.4 (Note 1b) 0.7 T , T Operating and Storage Junction Temperature Range 55 to +150 C J STG Thermal Characteristics R Thermal Resistance, Junction-to-Ambient (Note 1a) 86 (Single Operation) JA R Thermal Resistance, Junction-to-Ambient (Note 1b) 173 (Single Operation) JA C/W R Thermal Resistance, Junction-to-Ambient (Note 1c) 69 (Dual Operation) JA R Thermal Resistance, Junction-to-Ambient (Note 1d) 151 (Dual Operation) JA Package Marking and Ordering Information Device Marking Device Reel Size Tape width Quantity 029 FDMA1029PZ 7 8mm 3000 units 2009 Fairchild Semiconductor Corporation FDMA102 9PZ Rev.B4(W)