X-On Electronics has gained recognition as a prominent supplier of NTMFD5C680NLT1G MOSFETs across the USA, India, Europe, Australia, and various other global locations. NTMFD5C680NLT1G MOSFETs are a product manufactured by ON Semiconductor. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

NTMFD5C680NLT1G ON Semiconductor

NTMFD5C680NLT1G electronic component of ON Semiconductor
NTMFD5C680NLT1G ON Semiconductor
NTMFD5C680NLT1G MOSFETs
NTMFD5C680NLT1G  Semiconductors

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See Product Specifications
Part No. NTMFD5C680NLT1G
Manufacturer: ON Semiconductor
Category: MOSFETs
Description: MOSFET T6 60V LL SO8FL DUAL
Datasheet: NTMFD5C680NLT1G Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 4.4182 ea
Line Total: USD 4.42 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Fri. 03 Jan to Thu. 09 Jan
MOQ : 1500
Multiples : 1500
1500 : USD 0.8257
3000 : USD 0.8231
6000 : USD 0.8207
9000 : USD 0.8181
12000 : USD 0.8156
15000 : USD 0.8129
24000 : USD 0.8102
30000 : USD 0.8075
75000 : USD 0.8048

0
Ship by Wed. 01 Jan to Fri. 03 Jan
MOQ : 1
Multiples : 1
1 : USD 4.4182
10 : USD 1.6
100 : USD 1.2444
500 : USD 1.0248
1000 : USD 0.8094
1500 : USD 0.7592

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Configuration
Brand
Forward Transconductance - Min
Fall Time
Product Type
Rise Time
Factory Pack Quantity :
Subcategory
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
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We are delighted to provide the NTMFD5C680NLT1G from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the NTMFD5C680NLT1G and other electronic components in the MOSFETs category and beyond.

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NTMFD5C680NL MOSFET Power, Dual, N-Channel 60 V, 28 m , 26 A Features www.onsemi.com Small Footprint (5x6 mm) for Compact Design Low R to Minimize Conduction Losses DS(on) Low Q and Capacitance to Minimize Driver Losses G V R MAX I MAX (BR)DSS DS(ON) D These Devices are PbFree, Halogen Free/BFR Free and are RoHS 28 m 10 V 60 V Compliant 26 A 41 m 4.5 V MAXIMUM RATINGS (T = 25C unless otherwise noted) J Parameter Symbol Value Unit Dual NChannel DraintoSource Voltage V 60 V DSS D1 D2 GatetoSource Voltage V 20 V GS Continuous Drain T = 25C I 26 A D C Current R JC T = 100C 13 (Notes 1, 2, 3) C G1 G2 Steady State Power Dissipation P W T = 25C 19 C D R (Notes 1, 2) JC S1 S2 T = 100C 9.5 C Continuous Drain T = 25C I 7.5 A A D Current R JA T = 100C 5.3 (Notes 1, 2, 3) A MARKING Steady State DIAGRAM Power Dissipation T = 25C P 3.0 W D A R (Notes 1 & 2) D1 D1 JA T = 100C 1.5 A S1 D1 1 G1 D1 Pulsed Drain Current T = 25C, t = 10 s I 57 A XXXXXX A p DM DFN8 5x6 S2 AYWZZ D2 (SO8FL) Operating Junction and Storage Temperature T , T 55 to C J stg G2 D2 + 175 CASE 506BT D2 D2 Source Current (Body Diode) I 33 A S A = Assembly Location Single Pulse DraintoSource Avalanche E 47 mJ AS Y = Year Energy (I = 5 A) L(pk) W = Work Week Lead Temperature for Soldering Purposes T 260 C ZZ = Lot Traceability L (1/8 from case for 10 s) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be ORDERING INFORMATION assumed, damage may occur and reliability may be affected. See detailed ordering, marking and shipping information in the THERMAL RESISTANCE MAXIMUM RATINGS package dimensions section on page 5 of this data sheet. Parameter Symbol Value Unit JunctiontoCase Steady State R 3.74 C/W JC JunctiontoAmbient Steady State (Note 2) R 49 JA 1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 2 2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad. 3. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle. Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: May, 2019 Rev. P3 NTMFD5C680NL/DNTMFD5C680NL ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 60 V (BR)DSS GS D DraintoSource Breakdown Voltage V / 29 (BR)DSS mV/C Temperature Coefficient T J Zero Gate Voltage Drain Current I V = 0 V, T = 25 C 10 DSS GS J V = 60 V A DS T = 125C 100 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 4) Gate Threshold Voltage V V = V , I = 13 A 1.2 2.2 V GS(TH) GS DS D Negative Threshold Temperature Coefficient V /T 4.3 mV/C GS(TH) J DraintoSource On Resistance R V = 10 V I = 5 A 23 28 DS(on) GS D m V = 4.5 V I = 5 A 33 41 GS D Forward Transconductance g V = 15 V, I = 10 A 50 S FS DS D CHARGES, CAPACITANCES & GATE RESISTANCE Input Capacitance C 350 ISS Output Capacitance C 150 V = 0 V, f = 1 MHz, V = 25 V pF OSS GS DS Reverse Transfer Capacitance C 6 RSS Total Gate Charge Q V = 4.5 V, V = 48 V I = 10 A 2.0 G(TOT) GS DS D Total Gate Charge Q V = 10 V, V = 48 V I = 10 A 5.0 G(TOT) GS DS D Threshold Gate Charge Q 0.8 nC G(TH) GatetoSource Charge Q 1.2 GS V = 4.5 V, V = 48 V I = 10 A GS DS D GatetoDrain Charge Q 0.8 GD Plateau Voltage V 3.0 V GP SWITCHING CHARACTERISTICS (Note 5) TurnOn Delay Time t 6.4 d(ON) Rise Time t 25 r V = 4.5 V, V = 48 V, GS DS ns I = 5 A, R = 1.0 D G TurnOff Delay Time t 19 d(OFF) Fall Time t 23 f DRAINSOURCE DIODE CHARACTERISTICS Forward Diode Voltage V T = 25C 0.9 1.2 SD J V = 0 V, GS V I = 5 A S T = 125C 0.8 J Reverse Recovery Time t 17 RR Charge Time t 8 ns a V = 0 V, dI /dt = 10 A/ s, GS S I = 5 A S Discharge Time t 9 b Reverse Recovery Charge Q 7 nC RR Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Pulse Test: pulse width 300 s, duty cycle 2%. 5. Switching characteristics are independent of operating junction temperatures. www.onsemi.com 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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