NTD3055L170, NVD3055L170 MOSFET Power, N-Channel, Logic Level, DPAK/IPAK www.onsemi.com 9.0 A, 60 V Designed for low voltage, high speed switching applications in 9.0 AMPERES, 60 VOLTS power supplies, converters and power motor controls and bridge R = 170 m DS(on) circuits. D Features NVD Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements AECQ101 NChannel Qualified and PPAP Capable G These are PbFree Devices S Typical Applications Power Supplies 4 Converters 4 Power Motor Controls Bridge Circuits 1 2 1 2 MAXIMUM RATINGS (T = 25C unless otherwise noted) 3 3 J DPAK IPAK Rating Symbol Value Unit CASE 369C CASE 369D DraintoSource Voltage V 60 Vdc DSS (Surface Mounted) (Straight Lead) STYLE 2 STYLE 2 DraintoGate Voltage (R = 10 M ) V 60 Vdc DGR GS GatetoSource Voltage Vdc MARKING DIAGRAMS Continuous V 15 GS & PIN ASSIGNMENTS Nonrepetitive (t 10 ms) V 20 p GS Drain Current Adc 1 Gate Continuous T = 25C I 9.0 AYWW A D 4 Continuous T = 100C I 3.0 2 Drain 31 A D Drain Single Pulse (t 10 s) I 27 Apk 70LG p DM 3 Source Total Power Dissipation T = 25C P 28.5 W A D Derate above 25C 0.19 W/C Total Power Dissipation T = 25C (Note 1) 2.1 W 1 Gate A AYWW 4 Total Power Dissipation T = 25C (Note 2) 1.5 W A 2 Drain 31 Drain Operating and Storage Temperature Range T , T 55 to C J stg 70LG 3 Source 175 Single Pulse DraintoSource Avalanche E 30 mJ AS A = Assembly Location* Energy Starting T = 25C J Y = Year (V = 25 Vdc, V = 5.0 Vdc, DD GS WW = Work Week L = 1.0 mH, I (pk) = 7.75 A, V = 60 Vdc) L DS 3170L = Device Code Thermal Resistance C/W G = PbFree Package JunctiontoCase R 5.2 JC * The Assembly Location code (A) is front side JunctiontoAmbient (Note 1) R 71.4 JA optional. In cases where the Assembly Location is JunctiontoAmbient (Note 2) R 100 JA stamped in the package, the front side assembly Maximum Lead Temperature for Soldering T 260 C L code may be blank. Purposes, 1/8 from case for 10 seconds Stresses exceeding those listed in the Maximum Ratings table may damage the ORDERING INFORMATION device. If any of these limits are exceeded, device functionality should not be See detailed ordering and shipping information in the package assumed, damage may occur and reliability may be affected. dimensions section on page 8 of this data sheet. Semiconductor Components Industries, LLC, 2014 1 Publication Order Number: May, 2019 Rev. 7 NTD3055L170/DNTD3055L170, NVD3055L170 1. When surface mounted to an FR4 board using 0.5 sq in pad size. 2. When surface mounted to an FR4 board using minimum recommended pad size. www.onsemi.com 2