X-On Electronics has gained recognition as a prominent supplier of NVTFS003N04CTAG MOSFETs across the USA, India, Europe, Australia, and various other global locations. NVTFS003N04CTAG MOSFETs are a product manufactured by ON Semiconductor. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

NVTFS003N04CTAG ON Semiconductor

NVTFS003N04CTAG electronic component of ON Semiconductor
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Part No.NVTFS003N04CTAG
Manufacturer: ON Semiconductor
Category: MOSFETs
Description: Transistor MOSFET N-CH 40V 103A 8-Pin WDFN Surface Mount T/R
Datasheet: NVTFS003N04CTAG Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 2.4155 ea
Line Total: USD 2.42 
Availability - 474
Ship by Fri. 06 Dec to Wed. 11 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
474
Ship by Fri. 06 Dec to Wed. 11 Dec
MOQ : 1
Multiples : 1
1 : USD 2.4155
10 : USD 2.0646
30 : USD 1.8464
100 : USD 1.6207
500 : USD 1.5199
1500 : USD 1.4763

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Qualification
Configuration
Transistor Type
Brand
Forward Transconductance - Min
Fall Time
Product Type
Rise Time
Factory Pack Quantity :
Subcategory
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the NVTFS003N04CTAG from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the NVTFS003N04CTAG and other electronic components in the MOSFETs category and beyond.

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NVTFS003N04C MOSFET Power, Single N-Channel 40 V, 3.5 m , 103 A Features www.onsemi.com Small Footprint (3.3 x 3.3 mm) for Compact Design Low R to Minimize Conduction Losses DS(on) Low Capacitance to Minimize Driver Losses NVTFWS003N04C Wettable Flanks Product V R MAX I MAX (BR)DSS DS(on) D AECQ101 Qualified and PPAP Capable 40 V 103 A 3.5 m 10 V These Devices are PbFree and are RoHS Compliant MAXIMUM RATINGS (T = 25C unless otherwise noted) J NChannel Parameter Symbol Value Unit D (5 8) DraintoSource Voltage V 40 V DSS GatetoSource Voltage V 20 V GS Continuous Drain I A T = 25C 103 C D G (4) Current R JC T = 100C 58 (Notes 1, 2, 3, 4) C Steady State Power Dissipation T = 25C P 69 W S (1, 2, 3) C D R (Notes 1, 2, 3) JC T = 100C 22 C MARKING DIAGRAM Continuous Drain T = 25C I 22 A A D 1 Current R JA T = 100C 16 1 (Notes 1, 3, 4) A S D Steady XXXX WDFN8 S D State Power Dissipation P W T = 25C 3.2 A D AYWW S D ( 8FL) R (Notes 1, 3) JA G D T = 100C 1.6 CASE 511AB A Pulsed Drain Current T = 25C, t = 10 s I 484 A A p DM XXXX = Specific Device Code Operating Junction and Storage Temperature T , T 55 to C J stg A = Assembly Location Range +175 Y = Year Source Current (Body Diode) I 57 A S WW = Work Week = PbFree Package Single Pulse DraintoSource Avalanche E 155 mJ AS Energy (I = 7.4 A) (Note: Microdot may be in either location) L(pk) Lead Temperature for Soldering Purposes T 260 C L (1/8 from case for 10 s) ORDERING INFORMATION Stresses exceeding those listed in the Maximum Ratings table may damage the See detailed ordering, marking and shipping information in the device. If any of these limits are exceeded, device functionality should not be package dimensions section on page 5 of this data sheet. assumed, damage may occur and reliability may be affected. THERMAL RESISTANCE MAXIMUM RATINGS (Note 1) Parameter Symbol Value Unit JunctiontoCase Steady State (Note 3) R 2.2 C/W JC JunctiontoAmbient Steady State (Note 3) R 47 JA 1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 2. Psi ( ) is used as required per JESD51 12 for packages in which substantially less than 100% of the heat flows to single case surface. 2 3. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad. 4. Continuous DC current rating. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle. Semiconductor Components Industries, LLC, 2019 1 Publication Order Number: July, 2019 Rev. 0 NVTFS003N04C/DNVTFS003N04C ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 40 V (BR)DSS GS D Zero Gate Voltage Drain Current I T = 25C 10 A DSS J V = 0 V, GS V = 40 V DS T = 125C 250 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 5) Gate Threshold Voltage V V = V , I = 60 A 2.5 3.5 V GS(TH) GS DS D DraintoSource On Resistance R V = 10 V, I = 50 A 2.9 3.5 m DS(on) GS D Forward Transconductance g V = 15 V, I = 50 A 93 S FS DS D CHARGES AND CAPACITANCES Input Capacitance C 1600 pF iss V = 0 V, f = 1.0 MHz, GS Output Capacitance C 830 oss V = 25 V DS Reverse Transfer Capacitance C 28 rss Threshold Gate Charge Q 5.1 nC G(TH) GatetoSource Charge Q 9.0 GS V = 10 V, V = 20 V, I = 50 A GS DS D GatetoDrain Charge Q 3.5 GD Total Gate Charge Q V = 10 V, V = 20 V, I = 50 A 23 nC G(TOT) GS DS D SWITCHING CHARACTERISTICS (Note 6) TurnOn Delay Time t 10 ns d(on) Rise Time t 47 r V = 10 V, V = 20 V, GS DS I = 50 A D TurnOff Delay Time t 19 d(off) Fall Time t 3 f DRAINSOURCE DIODE CHARACTERISTICS Forward Diode Voltage V T = 25C 0.9 1.2 V SD J V = 0 V, GS I = 50 A S T = 125C 0.78 J Reverse Recovery Time t 37 ns RR Charge Time t 18 a V = 0 V, dl /dt = 100 A/ s, GS S I = 50 A S Discharge Time t 19 b Reverse Recovery Charge Q 23 nC RR 5. Pulse Test: Pulse Width 300 s, Duty Cycle 2%. 6. Switching characteristics are independent of operating junction temperatures. www.onsemi.com 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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