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NTD5804N, NTDV5804N, SVD5804N Power MOSFET 40 V, 69 A, Single NChannel, DPAK Features Low R DS(on) www.onsemi.com High Current Capability V R MAX I MAX Avalanche Energy Specified (BR)DSS DS(on) D NTDV, STDV and SVD Prefix for Automotive and Other 12 m 5.0 V 40 V 69 A Applications Requiring Unique Site and Control Change 7.5 m 10 V Requirements AECQ101 Qualified and PPAP Capable D These Devices are PbFree and are RoHS Compliant Applications NChannel CCFL Backlight G DC Motor Control Class D Amplifier S Power Supply Secondary Side Synchronous Rectification 4 MAXIMUM RATINGS (T = 25C unless otherwise noted) J 2 1 Parameter Symbol Value Unit 3 DraintoSource Voltage V 40 V DSS DPAK CASE 369C GatetoSource Voltage Continuous V 20 V GS (Surface Mount) GatetoSource Voltage V 30 V GS STYLE 2 NonRepetitive (t < 10 S) p Continuous Drain T = 25C I 69 A C D Current (R ) JC Steady T = 100C 49 (Note 1) MARKING DIAGRAM C State & PIN ASSIGNMENT Power Dissipation T = 25C P 71 W C D (R ) (Note 1) JC 4 Drain Pulsed Drain Current t = 10 s I 125 A p DM Operating Junction and Storage Temperature T , T 55 to C J stg 175 Source Current (Body Diode) I 60 A S Single Pulse DraintoSource Avalanche E 195 mJ AS 2 Energy (V = 50 V, V = 10 V, R = 25 , DD GS G Drain 1 3 I = 36 A, L = 0.3 mH, V = 40 V) L(pk) DS Gate Source Lead Temperature for Soldering Purposes T 260 C L A = Assembly Location* (1/8 from case for 10 s) Y = Year Stresses exceeding those listed in the Maximum Ratings table may damage the WW = Work Week device. If any of these limits are exceeded, device functionality should not be 5804N = Device Code assumed, damage may occur and reliability may be affected. G = PbFree Package THERMAL RESISTANCE MAXIMUM RATINGS * The Assembly Location code (A) is front side Parameter Symbol Value Unit optional. In cases where the Assembly Location is stamped in the package, the front side assembly JunctiontoCase (Drain) R 2.1 C/W JC code may be blank. JunctiontoAmbient Steady State (Note 1) 106 R JA 1. Surfacemounted on FR4 board using the minimum recommended pad size. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: November, 2016 Rev. 11 NTD5804N/D AYWW 58 04NG