RClamp3324P Low Capacitance RailClamp 4-Line Surge and ESD Protection PROTECTION PRODUCTS Description Features Transient Protection to RailClamp 3324P provides ESD protection for high- IEC 61000-4-2 (ESD) 20kV (Air), 17kV (Contact) speed data interfaces. It features a high maximum ESD IEC 61000-4-4 (EFT) 4kV (5/50ns) withstand voltage of 17kV contact and 20kV air IEC 61000-4-5 (Lightning) 4.5A (8/20s) discharge per IEC 61000-4-2. RClamp3324P is designed Package design optimized for high speed layout to minimize both the ESD peak clamping and the TLP Protects four high-speed data lines clamping. Package inductance is reduced at each pin Working Voltage: 3.3V Low Capacitance: 0.65 pF maximum (I/O to GND) resulting in lower peak ESD clamping voltage. The Dynamic Resistance: 0.15 Ohms (Typ) dynamic resistance is among the industrys lowest at Solid-State Silicon-Avalanche Technology 0.15 Ohms (typical). Maximum capacitance on each line to ground is 0.65pF allowing the RClamp3324P to be Mechanical Characteristics used in applications operating in excess of 5GHz without SGP2510P8 Package signal attenuation. Each device will protect up to four Pb-Free, Halogen Free, RoHS/WEEE Compliant lines (two high-speed pairs). Nominal Dimensions: 2.5 x 1.0 x 0.60 mm Lead Finish: NiPdAu RClamp3324P is in a 10-pin SGP2510P8 package Molding Compound Flammability Rating: UL 94V-0 Marking : Marking Code + Date Code measuring 2.5 x 1.0mm with a nominal height of Packaging : Tape and Reel 0.60mm. The leads have a nominal pin-to-pin pitch of 0.50mm. Flow- through package design simplifies PCB Applications layout and maintains signal integrity on high-speed lines. USB 3.0 Industrial Equipment The combination of low peak ESD clamping, low Digital Visual Interface dynamic resistance, and innovative package design LVDS Interfaces enables this device to provide the highest level of ESD eSATA protection for applications such as USB 3.0, eSATA, and DisplayPort. Nominal Dimension Functional Schematic 2.50 12 1.00 0.50 BSC 0.60 Device Schematic Nominal Dimensions in mm RClamp3324P 1 of 8 www.semtech.com Final Datasheet Rev 6.1 Semtech Revision date October 4, 2016Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Current (tp = 8/20s) I 4.5 A PP (1) ESD per IEC 61000-4-2 (Contact) 17 V kV (1) ESD ESD per IEC 61000-4-2 (Air) 20 O Operating Temperature T -40 to +125 C J O Storage Temperature T -55 to +150 C STG O Electrical Characteristics (T=25 C unless otherwise specified) Parameter Symbol Conditions Min. Typ. Max. Units O O -40 C to 125 C Reverse Stand-Off Voltage V 3.3 V RWM Any I/O pin to GND tp = 0.2/100ns (TLP) Trigger Voltage V 8 V TRIG Any I/O pin to GND O T = 25 C 0.01 0.05 A Reverse Leakage Current I V = 3.3V R RWM O T = 125 C 0.150 A I = 1A, tp = 8/20s, (2) PP Clamping Voltage V 2.5 3.5 V C Any I/O pin to GND I = 4.5A, tp = 8/20s, (2) PP Clamping Voltage V 3.5 4.5 V C Any I/O pin to GND I = 4A, tp = 0.2/100ns (TLP) (3) PP ESD Clamping Voltage V 3.5 V C Any I/O pin to GND I = 16A, tp = 0.2/100ns (TLP) (3) PP ESD Clamping Voltage V 5.3 V C Any I/O pin to GND tp = 0.2/100ns (TLP) (3), (4) Dynamic Resistance R 0.15 Ohms DYN Any I/O pin to GND V = 0V, f = 1MHz R 0.60 0.65 pF Any I/O pin to GND Junction Capacitance C J V = 0V, f = 1MHz R 0.30 0.40 pF Between I/O Pins Notes: (1): ESD Gun return path to Ground Reference Plane (GRP) (2): Measured using an 8/20us constant current source. (3): Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, I and V averaging window: t = 70ns to t = 90ns. TLP TLP 1 2 (4): Dynamic resistance calculated from I = 4A to I = 16A TLP TLP RClamp3324P 2 of 8 www.semtech.com Final Datasheet Rev 6.1 Semtech Revision Date October 4, 2016